应用于Ka波段无线通信的发射前端模块设计与制造

发布时间：2018-01-10 21:35

  本文关键词：应用于Ka波段无线通信的发射前端模块设计与制造　出处：《现代电子技术》2017年21期 　论文类型：期刊论文

  更多相关文章： 发射前端 温度 Ka波段 射频信号

【摘要】：介绍一种应用于Ka波段无线通信的发射前端模块,该模块由混频器、微带滤波器、压控振荡器、倍频器、功率放大器构成。射频(RF)信号工作在27.4~28 GHz频段内,中频信号固定在1 GHz。仿真结果显示,在工作频段内发射前端增益超过10 dB,发射功率为11.823 dBm,并且交调信号被抑制在63 dBc以下。在全部芯片工作的条件下,温度仿真结果显示芯片的结温低于64℃。测试结果显示,在工作频段内输出端信号线插入损耗低于0.34 dB,回波损耗小于-20 dB,VCO的8分频输出功率是-10.66 dBm。
[Abstract]:This paper introduces a transmitter front-end module for Ka-band wireless communication, which is composed of mixer, microstrip filter, voltage-controlled oscillator and frequency multiplier. The RF signal works in the 27.4 GHz band and the intermediate frequency signal is fixed at 1 GHz. The simulation results show that the RF signal works in the frequency range of 27.4 GHz and the intermediate frequency signal is fixed at 1 GHz. The front-end gain is more than 10 dB, the transmission power is 11.823 dBmand the intermodulation signal is suppressed below 63 dBc. The temperature simulation results show that the junction temperature of the chip is below 64 鈩，

本文编号：1406910