微带线热致无源互调产物计算模型

发布时间：2018-04-04 15:16

本文选题：互调干扰　切入点：微带线　出处：《西安电子科技大学学报》2017年03期

【摘要】：针对低无源互调特性微带线设计中的介质材料选择问题,建立了一种新的无源互调产物计算模型.该模型基于电热耦合效应,利用随时间作周期性变化的边界条件,结合一维热传导方程,得到了微带线导带温度与射频电流密度的关系式.在此基础上,通过分析受温度调制的电导率与载波电场的相互作用,获得了三阶互调产物电流密度与射频电流密度、介质板热学参数、长度和载波差频的关系式.进一步利用该模型计算了3种微带线的无源互调产物功率.结果表明,射频电流密度是影响无源互调产物的关键因素.该模型可以综合分析导带宽度、介质板热学参数、长度和载波差频对微带线三阶无源互调产物的影响,指导低无源互调特性微带线的设计.
[Abstract]:A new calculation model of passive intermodulation products is established for the selection of dielectric materials in the design of microstrip lines with low passive intermodulation characteristics.Based on the electrothermal coupling effect, the relationship between the linear conduction band temperature and the radio-frequency current density of the microstrip is obtained by using the boundary condition of periodic variation with time and the one-dimensional heat conduction equation.On this basis, by analyzing the interaction between the temperature modulated conductivity and the carrier electric field, the relationship between the current density of the third order intermodulation product and the RF current density, the thermal parameters of the dielectric plate, the length and the carrier frequency difference is obtained.Furthermore, the passive intermodulation power of three microstrip lines is calculated by using the model.The results show that the RF current density is the key factor to affect the passive intermodulation products.The model can comprehensively analyze the influence of the width of the conduction band, the thermal parameters of the dielectric plate, the length and the carrier difference frequency on the third order passive intermodulation products of the microstrip line, and guide the design of the microstrip line with low passive intermodulation characteristics.
【作者单位】：中国空间技术研究院西安分院空间微波技术重点实验室;西安交通大学电子与信息工程学院;
【基金】：国家自然科学基金资助项目(U1537211) 中国博士后科学基金资助项目(2015M572661XB) 空间微波技术重点实验室基金资助项目(9140C530101130C53013,9140C530101140C53231)
【分类号】：TN811

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