不同材料基片薄膜热传感器实验研究

发布时间：2018-06-10 14:00

  本文选题：基片 + 薄膜传感器　； 参考：《中国科技论文》2015年23期

【摘要】：为了寻找薄膜热传感器合适的基片材料,基于二氧化硅、聚酰亚胺薄膜和氧化铝陶瓷3种不同的基片材料,设计并制作了大小为4mm×8mm的复合薄膜热传感器,传感器包括一个用于热流测量的热电堆和一个用于温度测量的热电偶。综合测试发现:以聚酰亚胺薄膜为基片的传感器有良好的性能表现,其中,薄膜热电偶和薄膜热流计灵敏度分别为19.94μV/℃和0.010 121μV/(W·m-2),响应时间分别是0.26s和1.57s,薄膜热电偶静态标定拟合直线的相关系数均为0.997。
[Abstract]:In order to find suitable substrate material for thin film thermal sensor, a composite thin film thermal sensor with the size of 4mm 脳 8mm was designed and fabricated based on three different substrate materials, silicon dioxide, polyimide film and alumina ceramic. The sensor includes a thermoelectric stack for heat flow measurement and a thermocouple for temperature measurement. The comprehensive test shows that the sensor with polyimide film as substrate has good performance, among which, The sensitivity of the film thermocouple and the thin film thermometer are 19.94 渭 V / 鈩，

本文编号：2003464