MEMS谐振式压力传感器谐振器设计与分析
[Abstract]:Resonant pressure sensor is a typical MEMS device which makes use of the change of structure frequency under the action of external pressure to realize pressure measurement. This kind of sensor usually makes pressure film and indirect sensitive element resonance beam to feel external pressure, and realizes the secondary sensitive mode. It can output frequency signal directly, and its transmission and measurement can be directly applied to digital technology. It has a broad application prospect. In this paper, the principle of electrostatic drive / capacitance detection is adopted in the resonator. When the voltage U is applied to the package layer, the capacitance between the package layer and the resonance beam is produced, and then the electrostatic force acting on the resonance beam is generated. In the design process of resonator, the ideal capacitance formula is generally adopted, and the influence of edge effect is ignored, which makes the design results error with the practical application. In this paper, not only the influence of edge effect on the capacitance of resonator is considered, but also the influence of edge effect on the deformation, critical voltage and electrostatic stiffness of resonant beam in electromechanical coupling is also considered. At the same time, the resonator is modeled, and the effects of system parameters, voltage and edge effect on the frequency and sensitivity of the system are analyzed. The specific contents are as follows: (1) the existing theoretical formula of capacitance edge effect is analyzed. Considering the influence of length and thickness on the edge effect, the formula with small error is selected. At the same time, the capacitance formula between the plates whose packaging layer is much larger than that of the resonant beam is deduced. The calculation error of the model is large by using the existing plate capacitance formula, but the error of the capacitance calculation formula derived in this paper is small. At the same time, the influence of the size of the packaging layer on the capacitance is simulated and analyzed. When the size of the packaging layer is much larger than the size of the resonant beam, in a certain range, The size change of the package layer basically does not change the capacitance value. (2) when the electrostatic force acts on the resonant beam, the resonant beam will deform, and when the electrostatic force is greater than the recovery force of the resonant beam, the resonant beam will be adsorbed to the package layer; The warping deformation and critical voltage of resonant beam are solved by numerical and finite element analysis. When there is electrostatic force in the resonant beam, the electrostatic stiffness will be introduced. when the voltage is small, the influence of the deformation of the resonant beam will be ignored, and the electrostatic stiffness of the resonant beam will be solved. At the same time, the influence of edge effect on the deformation, critical voltage and electrostatic stiffness of resonant beam is considered. (3) the free vibration model of resonant beam is established, and the vibration mode and frequency of resonant beam and the equivalent mass of resonant beam are solved. When the electrostatic stiffness is introduced into the resonant beam, the equivalent stiffness of the resonant beam is softened and the resonant frequency is relatively reduced. by solving the ratio of electrostatic stiffness and mechanical stiffness, the resonant frequency under electromechanical coupling is further solved. The influence of voltage and edge effect on resonance frequency is analyzed. The resonator model is established, and the effects of system parameters such as resonance beam, pressure film, anchor point, voltage and edge effect on resonance frequency and sensitivity are analyzed.
【学位授予单位】:电子科技大学
【学位级别】:硕士
【学位授予年份】:2017
【分类号】:TP212
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