相变蓄能建筑墙体研究进展
发布时间：2019-01-30 21:41
【摘要】：对相变材料在墙体中的封装方式(直接混合、宏观封装、微观封装和定形相变材料封装)、相变材料的种类和物性等方面的研究进行了归纳总结.从实验和模拟2个方面,对相变材料位于墙体表面和墙体内部影响室内环境和建筑能耗的研究进行了综述和评价.分析表明,微观封装和定形相变材料的封装效果较好;墙体用相变材料的相变温度一般在20~30℃范围内;相变材料层在墙体中的安装位置可分为墙体表面和墙体内部2种,但相变材料层在墙体内的最优位置并不固定,受相变材料物性、墙体材料以及室内外环境工况的影响.通过相变材料与墙体合理高效的结合,可充分发挥相变材料的高蓄热特性,提高墙体的热性能,达到调节室内环境温度、降低建筑能耗的目的.
[Abstract]:In this paper, the encapsulation methods (direct mixing, macro encapsulation, microencapsulation and form-setting PCM encapsulation), the types and physical properties of PCMs in the wall are summarized and summarized. From the aspects of experiment and simulation, the research on the influence of phase change material on indoor environment and building energy consumption on the wall surface and the wall interior is summarized and evaluated. The results show that the encapsulation effect of microencapsulation and form-setting PCM is better, and the phase change temperature of PCM is generally in the range of 20 ~ 30 鈩，
本文编号：2418552
[Abstract]:In this paper, the encapsulation methods (direct mixing, macro encapsulation, microencapsulation and form-setting PCM encapsulation), the types and physical properties of PCMs in the wall are summarized and summarized. From the aspects of experiment and simulation, the research on the influence of phase change material on indoor environment and building energy consumption on the wall surface and the wall interior is summarized and evaluated. The results show that the encapsulation effect of microencapsulation and form-setting PCM is better, and the phase change temperature of PCM is generally in the range of 20 ~ 30 鈩，
本文编号：2418552
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