硅油基导热膏的制备与导热性能研究
发布时间:2018-01-04 14:32
本文关键词:硅油基导热膏的制备与导热性能研究 出处:《青岛科技大学》2015年硕士论文 论文类型:学位论文
更多相关文章: 热界面材料 导热膏 导热系数 硅烷偶联剂 填料搭配
【摘要】:热界面材料(TIMs)在实现功率元件与散热装置之间的快速传热方面有很重要的作用。其中,导热膏具有良好的导热性能,并具有一定的流动性,只需很薄的一层就可以有效的降低接触界面之间的热阻,在实现快速传热方面很有应用前景。本文用简单的物理研磨方法制备了氧化铝/硅油导热膏,用XRD和SEM等表征手段对两种不同形貌的氧化铝进行了表征,对改性后的氧化铝进行了红外分析,用KD2 Pro导热仪对制得的导热膏的导热系数进行测量。实验结果表明:氧化铝的加入可以有效的提高硅油的导热系数,球形氧化铝对导热的增强效果要好于非球形氧化铝,然而填充量却小于非球形氧化铝;导热膏的导热系数随着氧化铝填充量的增加而增大;氧化铝的粒径大小对导热膏的性能也有一定影响,在四中不同尺寸的氧化铝中,含40岬球形氧化铝的导热膏其导热系数最高;硅烷偶联剂(KH570)的加入可以有效的提高导热膏的导热系数;KH570的加入量在1.7wt.%-2.5wt.%时,导热膏具有最高的导热系数;不同粒径粉料的合理搭配可以有效提高导热膏的导热性能,40μm和5μm的球形氧化铝的混合比例在4:1时,63vol.%的导热膏的导热系数达到1.64W.m-1·K-1,比单一粒径的填充效果好很多。本文还制备了石墨纤维/硅油导热膏,研究了石墨纤维添加量、硅烷偶联剂使用、石墨纤维镀银处理以及金属粉的加入对体系导热性能的影响。研究结果表明:导热膏的导热系数随着石墨纤维添加量的增大而增大,最大填充量为56vo1.%,导热系数达到1.21W·m-1·K-1:硅烷偶联剂KH570的加入量在2wt.%-3wt.%时,效果最好;加入经过镀银处理的石墨纤维,体系的导热系数得到进一步提高;不同种类的导热粉料的混合使用要比单独的使用效果更好,石墨纤维与铜粉和镀银铜粉的最佳混合比例(体积比)分别为10:1和4:1。晶闸管散热器的系统热阻与循环水的流量、压装压力、加热功率有关,导热膏的加入可以在很大程度上降低系统的热阻。总体而言,自制的55vo1.%的石墨纤维与铜粉混合体系的导热膏的导热效果要好于填充体积为63vo1.%球形氧化铝体系的导热膏。
[Abstract]:Thermal interface material (TIMs) has a very important role in the realization of rapid heat transfer between the power element and the radiating device. The thermal paste has good thermal conductivity, and has certain liquidity, only a very thin layer can effectively reduce the thermal contact resistance of the interface, it has application prospect in to achieve rapid heat transfer. Alumina / silicone oil thermal paste prepared by means of physical grinding method simple, the characterization of two different morphologies of alumina by using XRD and SEM techniques, the modified alumina were analyzed by infrared analysis, measurement of thermal conductivity of thermal paste prepared by KD2 Pro thermal conductivity meter. The experimental results show that the addition of alumina can improve the thermal conductivity of silicone oil effectively, spherical alumina on the heat transfer of the reinforcing effect is better than the non spherical alumina, but non spherical filling amount is less than the oxidation Aluminium; thermal conductivity paste increases with the amount of alumina filled; properties of alumina particle size on the thermal paste also has certain effect in four different sizes of alumina, thermal paste containing 40 point spherical alumina, its thermal conductivity is highest; silane coupling agent (KH570) could improve the thermal conductivity the effective thermal paste; the amount of KH570 in 1.7wt.%-2.5wt.%, with the highest thermal conductivity thermal paste; reasonable collocation can effectively improve the thermal conductivity of thermal paste of different size powder, mixing ratio of spherical aluminum oxide 40 m and 5 m in 4:1, the thermal conductivity of the 63vol.% paste at 1.64W.m-1 K-1, than the single grain filling effect much better. The system also graphite fiber / silicone oil thermal paste by research, graphite fiber content, silane coupling agent, graphite fiber with silver plating And adding metal powder effect on the thermal performance of the system. The results show that the thermal conductivity of thermal paste increases with the increase of the content of graphite fiber, the maximum filling amount is 56vo1.%, the thermal conductivity reached 1.21W - M-1 - K-1: the amount of silane coupling agent KH570 has the best effect in 2wt.%-3wt.%, after adding graphite fiber; silver plating, thermal conductivity of the system has been further improved; mixed conducting powder of different kinds of use should be better than the separate use effect, the best ratio of graphite fiber and copper and silver plated copper powder (volume ratio) respectively for the system resistance and circulating water 10:1 and 4:1. thyristor radiator flow pressing pressure, heating power, thermal paste could reduce the thermal resistance of the system to a great extent. Overall, the thermal conductivity of graphite fiber made of 55vo1.% mixed with copper powder system The thermal conductivity of the paste is better than the heat conduction paste filled with 63vo1.% spherical alumina system.
【学位授予单位】:青岛科技大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TB34
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