有机基板表面覆膜接枝技术研究

发布时间：2018-01-05 07:11

  本文关键词：有机基板表面覆膜接枝技术研究　出处：《电子科技大学》2016年硕士论文　论文类型：学位论文

  更多相关文章： 有机基板 金属化 预处理 接枝改性

【摘要】：有机聚合物材料表面金属化后拥有导电、导热、易成型等优异性能,被广泛应用于生产与生活的各个方面。然而有机聚合物材料与其表面金属覆盖层之间的键合力较弱,研究有机聚合物材料表面金属化的前处理技术和金属化工艺就成为获得性能优良的表面金属层的关键。本论文以柔性聚酰亚胺(PI)薄膜及刚性聚苯醚(PPE)板材作为基板,围绕以上两种有机基板表面改性及表面金属化开展基础研究工作。论文主要研究内容如下:采用A碱溶液对PI薄膜进行表面预处理,研究预处理对PI薄膜表面粗糙度、浸润性以及官能团的影响。结果表明,经预处理后PI薄膜表面粗糙度增加,酰亚胺环结构因水解反应而打开,薄膜表面极性基团增加,浸润性提升。选取硫代硫酸钠、硫氰化钾以及硫脲为接枝单体对PI薄膜表面接枝改性,红外光谱分析表明三种接枝单体均能与PI薄膜形成化学键合,实现对PI薄膜的接枝改性。以硫代硫酸钠作为接枝单体,研究接枝率随单体浓度、接枝时间以及接枝温度的变化规律,获得优化的单体浓度为5 g/L,接枝时间为12 min,接枝温度为60℃。采用M氧化剂溶液对PPE板进行表面预处理,PPE板经预处理后,主链苯环上的甲基被氧化为羧基,表面极性基团增加,浸润性明显提升。采用氨丙基三乙氧基硅烷及巯丙基三乙氧基硅烷混合硅烷偶联剂对PPE板进行接枝改性,发现改性后基板S-H的伸缩振动峰、N-H的伸缩振动峰以及Si-O-H的伸缩振动峰强度均有所增强,偶联剂与PPE板形成化学键合。研究了固化时间及固化温度对接枝率的影响,发现适宜的固化时间为15 min,固化温度为50℃。通过化学镀法实现PI薄膜及PPE板的表面金属化。采用SEM、EDS及XRD对表面金属层的形貌、成分以及结构进行分析,结果表明所制备金属层均匀致密,可实现完整覆盖,不含杂质且结晶性好;对金属层的导电性、热稳定性以及金属层与基板间的结合性能进行研究,结果表明所制备金属层具有优良的导电性及热稳定性;结合力测试表明,金属层与PI薄膜间剥离强度达到6.0 N/cm,金属层与PPE板间结合力可达5B级标准。
[Abstract]:After metallization, organic polymer materials have excellent properties such as conducting, heat conduction, easy forming and so on. It is widely used in all aspects of production and life. However, the bonding force between organic polymer materials and metal coatings on their surfaces is weak. The study of metallization technology and metallization technology on the surface of organic polymer materials has become the key to obtain the surface metal layer with good performance. In this paper, flexible polyimide (Pi) thin films and rigid polyphenylene ether (PPE) films were used. PPEs are used as substrates. The basic research work is carried out around the above two kinds of organic substrate surface modification and surface metallization. The main contents of this thesis are as follows: the surface pretreatment of Pi thin films with A alkali solution is carried out. The effects of pretreatment on the surface roughness, wettability and functional groups of Pi thin films were studied. The results showed that the surface roughness of Pi films was increased and the structure of imide ring was opened due to hydrolysis. The surface of Pi film was modified with sodium thiosulfate, potassium thiocyanate and thiourea as graft monomer. The IR spectra showed that all three kinds of grafted monomers could form chemical bonding with Pi films, and the grafting rate of Pi films was studied with sodium thiosulfate as graft monomer. The optimum monomer concentration was 5 g / L and grafting time was 12 min. The grafting temperature was 60 鈩，

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