电场强度对Ti纳米晶薄膜生长模式及性能的影响

发布时间：2018-01-10 17:00

本文关键词：电场强度对Ti纳米晶薄膜生长模式及性能的影响　出处：《稀有金属材料与工程》2017年11期 　论文类型：期刊论文

【摘要】：采用强脉冲电场条件下物理气相沉积的方法,通过大幅提高脉冲峰值电流的方式,获得晶粒尺寸细小的Ti纳米晶薄膜,并依次对薄膜的生长模式及相关性能进行了对比研究。结果表明:较大的峰值电流可以获得晶粒尺寸细小的Ti纳米晶薄膜,但峰值电流的增大不能改变薄膜内晶体以Ti(100)晶面择优生长。薄膜的表面生长形貌表现为随峰值电流的增大,颗粒间隙大幅降低、粒子团聚尺寸增大、整体呈现圆球状紧密生长的结构。截面生长形貌表现为随峰值电流的增大逐渐由纤维状向柱状形貌过渡,并有效降低薄膜的内部缺陷,致密度显著提高。力学性能表现为随峰值电流的增大,薄膜的硬度、模量都呈现出先增大后减小的变化趋势,且当峰值电流增大到30~45 A之间时,Ti薄膜的硬度与模量存在最大值。
[Abstract]:The Ti nanocrystalline thin films with fine grain size were obtained by using the method of physical vapor deposition under the condition of strong pulse electric field and by greatly increasing the pulse peak current. The growth patterns and properties of the thin films were studied in turn. The results show that the thin Ti nanocrystalline thin films with fine grain size can be obtained with larger peak current. However, the increase of peak current can not change the preferential growth of the crystal in Ti-100) plane. The surface morphology of the film shows that with the increase of peak current, the particle gap decreases significantly. The particle agglomeration size increases, the whole presents the structure of spherical compact growth. The cross-section growth morphology is gradually transition from fibrous to columnar with the increase of peak current, and effectively reduces the internal defects of the film. The mechanical properties show that the hardness and modulus of the films increase first and then decrease with the increase of peak current, and when the peak current increases to 30 ~ 45A, the hardness and modulus of the films increase. The hardness and modulus of Ti film are maximum.
【作者单位】：西安理工大学;南京工业大学;南昌大学;
【基金】：国家自然科学基金(52171144)
【分类号】：TB383.2
【正文快照】： Ti基(Ti N,Ti C,Ti Al N等)薄膜材料因其在生长过程中易于形成尺寸较粗大的柱状晶,同时具有较高的硬度与较强的膜基结合力使其在机械加工与生产领域具有非常广泛的应用[1],但高硬度的同时由于成分混杂也导致薄膜材料具有较高的内应力,使得薄膜在受到较大的外界载荷时容易产生

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