碳纳米管化学镀铜增强铜基复合材料的工艺研究

发布时间：2018-01-20 10:58

  本文关键词： 碳纳米管 预处理 化学镀铜 CNTs/Cu复合材料　出处：《昆明理工大学》2017年硕士论文　论文类型：学位论文

【摘要】：碳纳米管(Carbon Nanotubes,CNTs)具有密度小、强度高、比表面积大、导电和导热性能优良、热膨胀系数低及耐强酸强碱等特性,但也存在容易团聚、润湿性差等缺点。本文通过在CNTs表面化学镀铜的方法对其进行表面改性处理,采用粉末冶金法制备CNTs/Cu复合材料,并对比了化学镀铜CNTs与原始CNTs对CNTs/Cu复合材料性能的影响。(1)对CNTs预处理工艺进行了研究,考察了 CNTs纯化、活化、敏化工艺对碳纳米管表面性能的影响。通过TEM、XRD、EDS、红外光谱等分析结果表明,经过预处理的CNTs表面镀覆一层Pd和SnO粒子共同构成的活化层。(2)对CNTs化学镀铜的工艺参数进行了研究,化学镀液配方由还原剂NaBH4、铜盐CuSO4 · 5H20、络合剂、稳定剂、分散剂组成。采用单因素法研究镀液pH值、施镀时间、施镀温度、CNTs浓度对CNTs化学镀铜层的影响,通过TEM、XRD、SEM、EDS分析CNTs表面铜层的均匀性和连续性,进而确定最优工艺条件为:pH=11、t=30min、T=50℃和CNTs浓度为0.08g/L。(3)对CNTs化学镀铜的界面组织进行了研究,通过TEM观察到化学镀铜CNTs的界面结合为铜的(110)晶面与碳层浸润形成过渡层,其夹角小于90°;通过电子探针发现化学镀铜增加了 CNTs与铜的润湿性,改善了 CNTs的分散性;探讨了 CNTs表面化学镀铜的机理源于由原子氢机析出理和电子还原机理共同作用。(4)对CNTs/Cu复合材料的力学性能和电性能进行了研究,将化学镀铜CNTs和原始CNTs分别加入纯铜粉中进行高能球磨得到CNTs/Cu复合粉末。通过对CNTs/Cu复合粉末的粒度中位径D50和松装密度检测,得到在CNTs含量为0.25wt%时,经过化学镀铜的CNTs/Cu复合粉末的粒度D50和松装密度分别由50.91μm和2.67g/cm3下降到39.12μm和2.24g/cm3;并通过真空热压成型后发现化学镀铜CNTs/Cu复合材料的导电率、抗拉强度和硬度都高于未进行化学镀铜的CNTs/Cu复合材料,在CNTs含量为0.25wt%时,未进行化学镀铜CNTs/Cu复合粉末和化学镀铜CNTs/Cu复合粉末的导电率分别为62.5%IACS和77.21%IACS,抗拉强度分别为212.50MPa和272.174MPa,硬度分别为34.6Hv和 40.9Hv。
[Abstract]:Carbon nanotubes (CNTs) are characterized by low density, high strength, large specific surface area, excellent conductivity and thermal conductivity, low thermal expansion coefficient and strong acid and alkali resistance. However, there are some disadvantages such as easy agglomeration and poor wettability. In this paper, the surface of CNTs was modified by electroless copper plating, and the CNTs/Cu composite was prepared by powder metallurgy. The effects of electroless copper plated CNTs and original CNTs on the properties of CNTs/Cu composites were compared. The pretreatment process of CNTs was studied. The purification and activation of CNTs were investigated. Effects of sensitization process on surface properties of carbon nanotubes. The process parameters of electroless copper plating on CNTs were studied by coating an activated layer of PD and SnO particles on the surface of CNTs. The formula of electroless plating solution is composed of reducing agent NaBH4, copper salt CuSO4 路5H20, complexing agent, stabilizer and dispersant. The pH value of plating solution, plating time and plating temperature are studied by single factor method. The effect of CNTs concentration on the electroless copper plating on CNTs was studied. The uniformity and continuity of copper coating on CNTs surface were analyzed by TEM XRDX SEME-EDS. The interfacial structure of electroless copper plating on CNTs was studied under the optimum technological conditions of 30 min t ~ (50 鈩，

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