CTBN增韧环氧树脂微孔发泡研究

发布时间：2018-02-04 02:24

  本文关键词： EP/CTBN共混体系 超临界CO 橡胶分相 泡孔生长 泡孔形貌　出处：《工程塑料应用》2017年04期 　论文类型：期刊论文

【摘要】：研究了液体端羧基丁腈橡胶(CTBN)增韧高分子量环氧树脂(EP,牌号CYD 014U)的超临界二氧化碳(SC CO_2)微孔发泡及其泡孔结构,通过差示扫描量热(DSC)、动态热力学分析(DMA)和扫描电子显微镜(SEM)分别研究了不同含量CTBN共混体系的热性能、动态模量、断面形貌和不同发泡条件下的泡孔结构。研究发现,当CTBN含量从0%增加到30%时,EP/CTBN体系的玻璃化转变温度持续下降,其DSC测试结果从98.44℃下降至81.89℃。SEM观察断面和气体传质发现,CTBN含量增加基体塑化,出现两相结构,体系气体吸附量增加,解吸附速率加快。CTBN含量为10%~15%时,经60℃/12 MPa/72 h气体饱和以及110℃发泡10~15 s,泡孔尺寸为1~2μm,泡孔密度为5.60×10~(10)~6.28×10~(10)个/cm~3;随着发泡时间增加,泡孔经历成核、生长、聚并三个阶段,泡孔尺寸增加,泡孔密度先增后降。
[Abstract]:The high molecular weight epoxy resin (EP) toughened by liquid carboxylic acrylonitrile butadiene rubber (CTBN) was studied. The supercritical carbon dioxide (CYD) supercritical carbon dioxide (SCC) and its foaming structure were studied by differential scanning calorimetry (DSC). Dynamic thermodynamic analysis (DMA) and scanning electron microscopy (SEM) were used to study the thermal properties and dynamic modulus of CTBN blends with different contents. The results show that the glass transition temperature of EPCTBN system decreases continuously when the content of CTBN increases from 0% to 30. The DSC results decreased from 98.44 鈩，

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