超细晶W-Cu复合材料的热挤压与热处理

发布时间：2018-03-04 04:11

  本文选题：水热共还原　切入点：真空烧结　出处：《粉末冶金材料科学与工程》2016年01期 　论文类型：期刊论文

【摘要】：以水热共还原法制备纳米W-30%Cu复合粉末,通过真空烧结和包套热挤压制备超细晶W-Cu复合材料,并进行后续热处理。采用X射线衍射、高分辨率透射电镜、扫描电镜等观察和分析W-30%Cu复合粉体和合金的成分及组织形貌,研究热挤压及后续退火处理对材料致密度、电导率和硬度等性能的影响。结果表明:水热产物为纳米级(10~15 nm)规则的类球形结构,经煅烧及共还原后得到的W-30%Cu复合粉末粒度细小,呈特殊的W包覆Cu结构,颗粒分布均匀;复合粉末在1050℃真空烧结后相对密度只有91.5%,经热挤压后致密度提高到97.07%,布氏硬度达到223,组织细密,W相和Cu相分布均匀,钨颗粒细小(1~3μm),形成典型的钨骨架和铜网络结构。经过后续的退火处理,钨铜分布更均匀,钨粒径进一步减小,材料的致密度和电导率都更高,分别为98.82%和43.31%IACS,形成良好的综合性能指标匹配。
[Abstract]:Nanocrystalline W-30 and Cu composite powders were prepared by hydrothermal co-reduction method. Ultrafine grain W-Cu composites were prepared by vacuum sintering and hot extrusion, followed by heat treatment. X-ray diffraction and high resolution transmission electron microscopy were used. The composition and microstructure of W-30Cu composite powder and alloy were observed and analyzed by scanning electron microscope (SEM). The density of W-30Cu composite powder and alloy was studied by hot extrusion and subsequent annealing. The results show that the hydrothermal product is a regular spherical structure of nanometer scale 1015 nm. The W-30Cu composite powder obtained by calcination and co-reduction has a fine particle size and a special W coated Cu structure, and the particle distribution is uniform. The relative density of the composite powder sintered in vacuum at 1050 鈩，

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