聚噻吩插层有机蒙脱土导电复合材料的制备及其修饰

发布时间：2018-03-10 22:39

  本文选题：聚噻吩　切入点：有机蒙脱土　出处：《矿物岩石》2017年01期 　论文类型：期刊论文

【摘要】：实验采用Fe~(3+)-H_2O_2催化氧化体系,以水为介质,十二烷基苯磺酸钠(十二烷基苯磺酸钠)为乳化剂,室温下制备聚噻吩(PTP)有机蒙脱土(OMMT)复合材料。当有机蒙脱土/聚噻吩=2g/ml时,反应时间为12 h,制得复合材料电导率最高,其值为3.44×10~(-5)S/cm;在Fe~(3+)-H_2O_2和过硫酸铵(APS)两种氧化体系下,分别采用苯胺(ANI)和吡咯(PY)对聚噻吩-有机蒙脱土进行修饰,制得聚苯胺-(聚噻吩-有机蒙脱土)和聚吡咯-(聚噻吩-有机蒙脱土)复合材料的电导率均达到10~(-2)S/cm~10~(-1)S/cm,较未修饰时提高了10~3倍~10~4倍。傅里叶红外光谱(FTIR)和X射线衍射(XRD)表明噻吩(TP)进入有机蒙脱土层间聚合,形成插层复合,经苯胺和吡咯修饰后,插层结构没有被破坏;重分析(TG)则证实复合后材料热稳定性得到提高,500℃时失重在11.69%左右,但经修饰后材料的热稳定性有所降低500℃时失重达到80%以上。扫描电镜(SEM)表明在Fe~(3+)-H_2O_2氧化体系下,经修饰后材料形貌更规整,且均为球形。
[Abstract]:The organic montmorillonite (OMT) composite was prepared by using Fe~(3 / H _ 2O _ 2 catalytic oxidation system with water as the medium and sodium 12 alkylbenzene sulfonate (12 alkylbenzene sulfonate) as emulsifier at room temperature. When the organic montmorillonite / polythiophene was 2 g / ml, the organic montmorillonite / polythiophene montmorillonite was prepared at room temperature. When the reaction time was 12 h, the conductivity of the composite was the highest, with the value of 3.44 脳 10 ~ (-5) S / cm. The polythiophene / organic montmorillonite was modified by aniline ANI (aniline) and pyrrole pyrrolidine (Pyrrole) in the oxidation systems of Fe~(3 / H _ 2O _ 2 and ammonium persulfate respectively. The conductivity of Polyaniline (polythiophene organic montmorillonite) and polypyrrole (polythiophene organic montmorillonite) composites reached 10 ~ (10) ~ (-2) S / cm ~ (-1) ~ (-1) S / cm ~ (-1), 10 ~ (3) times and 10 ~ (4) times higher than that without modification. Fourier transform Infrared Spectroscopy (FTIR) and X-ray diffraction (XRD) were used to study the properties of polyaniline (poly (thiophene) -organic montmorillonite) and X-ray diffraction (XRD). The results of XRD showed that thiophene TPs were polymerized into organic montmorillonite interlayer. The intercalation composite was formed and modified by aniline and pyrrole, the intercalation structure was not destroyed, and the reanalysis confirmed that the thermal stability of the composite was improved at 11.69% 鈩，

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