胶黏复合材料导热性能的数值模拟

发布时间：2018-03-13 19:28

本文选题：ANSYS　切入点：导热复合材料　出处：《杭州电子科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着电子产品散热问题越来越突出,具有优良导热性能的胶黏复合材料已成为研究的热点。本文通过VC++,ANSYS和MATLAB联合编程设计了一种参数化有限元分析方法,实现了胶黏复合材料导热性能的数值模拟。以AlN/EP导热胶黏复合材料为研究实例,通过比较复合材料导热率的模拟值与实验值验证了该方法的可靠性。并借助有限元分析方法探究了填料粒子的空间分布、粒径大小、不同粒径配比、粒子形状对胶黏复合材料导热性能的影响。具体研究内容如下:在网状分布、随机分布和均匀分布这三种粒子空间分布中,网状分布体系中的粒子容易聚集形成导热网链,它对填充体系的导热率影响最大。其他空间分布体系因为不能形成有效的导热通路,故对填充体系的导热率影响不大。由此可见,使填料粒子分布不均匀是提高体系导热率的有效方法。选择10μm,40μm,70μm,100μm四种粒径的AlN粒子填充环氧树脂基体探究粒子的大小对复合材料导热率的影响。模拟结果表明,粒子粒径在一定范围内变化(10μm~40μm)时,粒径越大,其填充体系的导热率越大,但粒径增加超过这个范围(大于40μm)后,粒径的大小对其填充体系导热性能的影响并不大。选择合适大小的填料粒子是提高体系导热性能有效的途径。40μm/10μm不同粒径配比时,小粒子可以填充在大粒子间的缝隙中,将分散的大粒子连接起来,形成导热网链,使得混合配比体系的导热率高于单一粒径填充体系。并且在两种粒径配比达到最佳时,其填料体系的导热率最大。比较40μm/10μm和100μm/10μm两种配比填充效果后,发现粒径差别越大越能改善体系的导热性能。通过比较球形、椭球形和立方形的三种导热粒子的填充体系的导热率,可以知道,在低填充量下,粒子形状对体系导热率影响不大。但随着填充量的增加,立方形粒子能迅速提高填充体系的导热率,椭球形粒子次之,球形粒子最慢,并且这三种填充体系导热率的差距越来越大,特别是立方形粒子和球形粒子两种填充体系。由此可知,细长形的粒子容易与其他粒子建立连接,形成导热网链,提高导热率。
[Abstract]:With the electronic product radiation has become more and more prominent, the adhesive composite material has excellent thermal conductivity has become a research hotspot. In this paper, through VC++, ANSYS and MATLAB joint programming design a parametric finite element analysis method, the numerical simulation of thermal conductivity of the adhesive composite materials. With AlN/EP conductive adhesive composite as the research example the reliability of this method is verified by comparing with experimental values of composite thermal conductivity values. Simulation and finite element analysis method to explore the distribution of filler particles in space, particle size, different ratio of particle size, particle shape effect on the thermal conductivity of the adhesive composite material. The specific contents are as follows: in the network distribution, random distribution and the uniform distribution of these three kinds of particles in the space of network distribution system in the aggregation of particles are easy to form the heat conducting network chain, which affected the rate of heat conduction for filling system The largest. Other spatial distribution system because can not form effective conduction path, conducting rate has little effect on filling system. Thus, the uneven distribution of filler particles is an effective method to improve the thermal conductivity of the system. 10 m, 40 m, 70 m, 100 m with four different particle sizes AlN the particle effect of epoxy resin on the particle size of the composite heat transfer rate. The simulation results show that the particle size varies in a certain range (10 m~40 m), the larger particle size, the thermal conductivity of filled system rate is higher, but the particle size increases over this range (greater than 40 m after the effect of the size of the particle size) on the thermal conductivity of filled system is not large. Choose the suitable size of filler particles is to improve the system thermal performance effective way.40 m/10 m with different particle size ratio, small particles can be filled in the gap between the particles, the particles dispersed connection Together, forming a heat conductive network chain, makes the thermal mixing system was higher than that of single grain filling system. And in two the ratio of particle size to achieve the best thermal conductivity, the filler system. The maximum rate 40 m/10 m and 100 m/10 m two ratio of filling effect, found that the particle size difference the more can improve the thermal performance of the system. By comparing the thermal spherical system filled with three kinds of thermal ellipsoid particles and cubic shape of the rate, can know, at low loading rate, particle shape has little effect on the heat conduction system. But with the increase of filling quantity, cube shaped particles can quickly improve the thermal conductivity of filled system the rate of spheroidal particle of spherical particles, the slowest, and the three gap filling system of thermal conductivity is more and more big, especially the cube shaped particles and spherical particles of two kinds of filling system. Therefore, elongated particles and other particles to build A connection is made to form a heat conduction network chain to improve the thermal conductivity.

【学位授予单位】：杭州电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TB33

【相似文献】