环氧复合材料的制备及导热性能研究

发布时间：2018-03-17 00:13

本文选题：环氧树脂　切入点：复合材料　出处：《昆明理工大学》2017年硕士论文　论文类型：学位论文

【摘要】：随着电子设备及照明设备向着小型化、大规模集成化及高功率化发展,电子设备中的集成电路工作过程中会产生越来越多的热量,且产生热量的部位较为集中。若不能及时地将这些热量传递出去,会大大地降低设备的工作效率及寿命,甚至失效。环氧树脂通常被作为电子器件的绝缘封装材料,然而导热系数很低,室温下只有0.1～0.2 Wm-1K-1左右,热膨胀系数较大,难以与硅电子元器件始终贴合在一起,无法保证良好的散热效果。大长径比与高比表面积的碳化硅纳米线(SiCNWs)由于本身具有高导热性能、高热稳定性、高击穿电场、优异的机械性能及耐腐蚀性,作为填料能够以很低的含量引入环氧树脂中,能有效提高其导热性能、降低环氧树脂的热膨系数或热变形参数。本文采用一种简单的溶液共混法在环氧树脂基体中引入极少量的SiC NWs制备出Epoxy/SiCNWs复合材料,以此改善其导热性能及热稳定性。在此基础上,采用高温处理SiCNWs制备出核壳结构的纳米线SiC@Si02NWs,使得纳米线之间,及SiC@Si02 NWs与环氧树脂之间有一层Si02作为声子振动的过渡层,从而进一步的提高了环氧复合材料(Epoxy/SiC@Si02NWs)的导热性能。在核壳结构SiC@Si02 NWs的启发下,通过真空抽滤方法,制备出具有核壳结构的石墨烯包覆碳纤维杂化填料,并与环氧树脂复合制备出Epoxy/CF@G复合材料,极大的提高了环氧树脂的导热性能。通过LFA、IR、DSC和TG等仪器对复合材料的导热性能和热稳定性进行表征发现:(1)Epoxy/SiCNWs复合材料的导热系数最大达到了 0.449 Wm-1K-1,相比于纯环氧树脂,其导热系数提高了 106%,热变形量参数优于同类文献所制备的复合材料;(2)采用良好界面浸润性的核壳结构SiC@SiO2 NWs制备的Epoxy/SiC@Si02NWs复合材料的最大导热系数达到了 0.391 Wm-1K-1,相比于纯环氧树脂提高了 79.4%,同时导热性能优于同等含量的Epoxy/SiC NWs复合材料。(3)采用核壳结构的CF@G制备的Epoxy/CF@G复合材料相比于CF/Epoxy导热性能明显提高了一倍,最大导热系数达1.19Wm-1K-1,储存模量提高了 1248.7%,热机械性能有极大的提升。由此,制备的复合材料在电子封装领域具有较大的应用前景。
[Abstract]:With the development of electronic equipment and lighting equipment towards miniaturization, large-scale integration and high power, the integrated circuit in electronic equipment will produce more and more heat in the working process. If the heat is not transmitted in time, the efficiency and service life of the equipment will be greatly reduced, or even defunct. Epoxy resin is usually used as an insulating packaging material for electronic devices. However, the thermal conductivity is very low. At room temperature, it is only about 0.1 Wm-1K-1, and the coefficient of thermal expansion is large, so it is difficult to bond with silicon electronic components all the time. Because of its high thermal conductivity, high thermal stability, high breakdown electric field, excellent mechanical properties and corrosion resistance, As fillers can be introduced into epoxy resin at a very low content, it can effectively improve its thermal conductivity. In this paper, a simple solution blending method was used to prepare Epoxy/SiCNWs composites by introducing a small amount of SiCNWs into epoxy resin matrix. In order to improve its thermal conductivity and thermal stability, a core-shell structure nanowire SICP Si02NWswas prepared by high temperature treatment of SiCNWs, so that there is a layer of Si02 between nanowires and between SiC@Si02NWs and epoxy resin as the transition layer for phonon vibration. The thermal conductivity of epoxy composite Epoxyr / sic @ Si02NWs was further improved. Under the inspiration of core-shell structure SiC@Si02NWs, graphene coated carbon fiber hybrid filler with core-shell structure was prepared by vacuum filtration method. Epoxy/CF@G composites were prepared by blending with epoxy resin. The thermal conductivity and thermal stability of the composites were characterized by LFA-IR DSC and TG. It was found that the maximum thermal conductivity of the Epoxy- / SiCNWs composite was 0.449 Wm-1K-1, which was higher than that of pure epoxy resin. The thermal conductivity of the composite is increased by 106, and the thermal deformation parameter is better than that of the composite prepared by the same literature.) the maximum thermal conductivity of the Epoxy/SiC@Si02NWs composite prepared by using core-shell structure SiC@SiO2 NWs with good interfacial wettability is 0.391 Wm-1K-1, compared with that of the core-shell structure with good interfacial wettability. The thermal conductivity of the pure epoxy resin is 79.4%, and the thermal conductivity is better than that of the same content of Epoxy/SiC NWs composite. 3) compared with CF/Epoxy, the thermal conductivity of the Epoxy/CF@G composite prepared by using core-shell structure CF@G is much higher than that of CF/Epoxy. The maximum thermal conductivity is 1.19Wm-1K-1, the storage modulus is increased by 1248.7and the thermo-mechanical properties are greatly improved.
【学位授予单位】：昆明理工大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TB332

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