SiC颗粒表面金属化工艺及显微组织分析

发布时间：2018-04-19 09:47

  本文选题：SiC颗粒 + 化学镀　； 参考：《材料科学与工艺》2017年06期

【摘要】：为改善碳化硅颗粒与金属的润湿性,本文研究了在碳化硅颗粒表面金属化即沉积Ni-P层的工艺方法.首先采用表面清洁处理,继而采用粗化和活化敏化工艺对平均尺寸为5μm的Si C颗粒进行预处理,实现了在化学镀镍前在碳化硅表面产生微小的缺陷,并吸附Pd作为催化活性物质,为后序化学镀过程Ni-P的吸附、形核、长大提供了有利条件.利用正交试验方法,结合增重百分率和镍元素的相对含量等指标,研究了化学镀液的成分对镀层组织及形貌的影响.研究发现,当化学镀液中[Ni~(2+)]浓度为0.25 mol/L、[NH_4~+]浓度为0.6 mol/L,[Ni~(2+)]/[H_2PO_2~-]浓度之比为0.4、柠檬酸浓度为0.1 mol/L及pH为10,温度为45℃时,SiC颗粒表面完全包覆Ni-P.通过比较实验可知,预处理中活化敏化过程对后续Ni-P合金的包覆有重要促进作用.同时,化学镀液各成分中对施镀效果的影响顺序为:溶液中[Ni~(2+)]浓度pH柠檬酸三钠的含量温度[Ni~(2+)]/[H_2PO_2~-]浓度之比[NH_4~+]浓度.
[Abstract]:In order to improve the wettability of silicon carbide particles with metals, the process of metallization or deposition of Ni-P layer on the surface of silicon carbide particles has been studied in this paper.Firstly, the surface was cleaned, then the sic particles with an average size of 5 渭 m were pretreated by coarsening and activation sensitization, which resulted in minor defects on the surface of silicon carbide before electroless nickel plating.The adsorption of PD as a catalytic active substance provides a favorable condition for the adsorption nucleation and growth of Ni-P in the post-sequence electroless plating process.The effect of the composition of electroless plating solution on the microstructure and morphology of the electroless plating solution was studied by means of orthogonal test combined with the weight gain percentage and the relative content of nickel.It is found that when the concentration of [Ni~(2] in electroless plating solution is 0.25 mol / L, the concentration of [NH _ 4 ~] is 0.6 mol / L, the ratio of [Ni~(2] / [H _ 2PO _ 2S] concentration is 0.4, the concentration of citric acid is 0.1 mol/L and pH is 10, and the temperature is 45 鈩，

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