直流反应磁控溅射沉积a-C:H薄膜的微结构和摩擦磨损行为

发布时间：2018-05-20 03:21

  本文选题：磁控溅射 + a-C　； 参考：《有色金属科学与工程》2016年01期

【摘要】：采用直流的反应磁控溅射技术,以高纯石墨为溅射靶材和CH_4为反应气体,调节CH_4流量,在p(100)单晶硅和不锈钢基底上成功制备出系列的含氢a-C:H薄膜.利用场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)、Raman光谱、纳米压痕仪、CSM划痕测试仪、摩擦磨损试验机等测试手段对所制备含氢a-C:H薄膜的微结构、力学性能和摩擦磨损行为进行系统表征.结果表明:随着CH_4流量的增加,含氢a-C:H薄膜的致密度呈现出微弱的先增加后减小的趋势;薄膜的沉积速率随着CH_4流量的增加逐渐增加,但增幅呈现出逐渐减小趋势;随着CH_4流量的增加,薄膜中sp~3杂化键含量及其纳米硬度和杨氏模量也呈现出先增加后减小的规律;摩擦实验结果表明当CH_4流量为8 sccm,所制备的含氢a-C:H薄膜的摩擦学性能最佳,摩擦系数为0.20,磨损率为6.48×10~(-7)mm~3/(N·m).
[Abstract]:A series of hydrogen-containing a-C:H thin films were successfully prepared on the substrate of pX100) by DC reactive magnetron sputtering with high purity graphite as the sputtering target and CH_4 as the reactive gas and adjusting the flow rate of CH_4. The microstructure of hydrogen-containing a-C:H films was investigated by means of field emission scanning electron microscope (SEM), atomic force microscope (AFM), nano-indentation instrument (CSM) scratch tester, friction and wear tester, etc. Mechanical properties and friction and wear behaviors were systematically characterized. The results show that the density of hydrogen-containing a-C:H films increases slightly and then decreases with the increase of CH_4 flow rate, and the deposition rate increases gradually with the increase of CH_4 flow rate, but decreases gradually with the increase of CH_4 flow rate. With the increase of the flow rate of CH_4, the content of sp~3 hybrid bond and its nano-hardness and Young's modulus in the films increased first and then decreased, and the tribological properties of the hydrogen-containing a-C:H films were the best when the flow rate of CH_4 was 8sccm. The friction coefficient is 0.20 and the wear rate is 6.48 脳 10~(-7)mm~3/(N.
【作者单位】： 江西理工大学材料科学与工程学院;
【基金】：国家自然科学基金资助项目(51302116) 中科学院兰化所国家重点实验室开放基金项目(LSL-1203)
【分类号】：TB383.2
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本文编号：1912975