Cu基三元合金纳米化学镀层的制备与表征

发布时间：2018-05-23 12:36

本文选题：化学镀 + 纳米镀层　；参考：《湖南师范大学》2015年硕士论文

【摘要】：化学镀铜在电子、通讯和电工等行业中应用越来越广泛。因此,对其镀层耐蚀性、耐热性、结合力等性能要求日益严格。多元合金纳米镀层具有优异的物理、化学性能,但目前对化学镀铜基多元合金纳米镀层的研究几乎没有。本文主要研究Cu基三元合金纳米镀层的制备与表征:通过化学镀方法制备Cu-Ni-P、Cu-Sn-P、Cu-Sn-B、Cu-W-P纳米镀层,分析镀液中主盐浓度比值、还原剂浓度、络合剂浓度、pH值以及热处理对镀层的影响,采用扫描电子显微镜、X射线衍射仪对纳米镀层的表面形貌、成分、结构进行表征。发现:1.Cu-Sn-P纳米镀层镀速随主盐浓度比值增加先急剧下降,后趋于平稳;络合剂总浓度过大、过小或者单独使用时,镀速较慢。还原剂浓度为0.3 mol·L-1,p H值为13时镀速最为理想。2.酸性镀液中,Cu-Sn-P纳米镀层出现明显腐蚀点,但碱性镀液中镀层不出现腐蚀点,镀层颗粒分布均匀。镀层腐蚀点处Sn含量较高,可以推测镀层受到腐蚀时,镀层中的Cu先被腐蚀。3.Cu-Sn-P纳米镀层中,团聚物呈类球形结构,镀层颗粒呈规则立方体形,小颗粒尺寸在100nm以下;Cu-Sn-B纳米镀层中,团聚物呈花朵状结构,镀层颗粒呈椭圆片状,片状短直径小于150nm;Cu-W-P纳米镀层,团聚物呈三角片状,三角片状边长小于100nm。4.镀层结构不随工艺配方的改变而改变。纳米镀层Cu-Ni-P、Cu-Sn-P、Cu-Sn-B、Cu-W-P在2??43.29°时出现Cu(111),在2?=50.43°时出现Cu(200)。5.热处理后纳米镀层团聚物更为分散,尺寸减小,团聚物边缘发生融合,镀层由非晶态向晶态转化。
[Abstract]:Electroless copper plating is more and more widely used in electronic, communication and electrical industries. Therefore, the coating corrosion resistance, heat resistance, adhesion and other performance requirements are increasingly stringent. Multicomponent alloy nanocrystalline coatings have excellent physical and chemical properties, but there is little research on electroless copper-based multicomponent alloy nanocrystalline coatings. In this paper, the preparation and characterization of Cu based ternary alloy nanocrystalline coatings were studied. The effects of the ratio of main salt concentration, concentration of reductant, concentration of complex agent, pH value of complexing agent and heat treatment on the coating were analyzed by electroless plating. The surface morphology, composition and structure of nanocrystalline coatings were characterized by scanning electron microscope (SEM) and X-ray diffraction (XRD). It is found that the plating rate of Cu-Sn-P nanoplating decreases sharply with the increase of the ratio of main salt concentration, and then tends to steady, and the plating speed is slower when the total concentration of the complex agent is too large, too small or used alone. The reduction agent concentration is 0.3 mol L ~ (-1) p H value is 13:00 plating speed is the most ideal. 2. The corrosion point of Cu-Sn-P nanocrystalline coating in acidic plating solution was obvious, but the corrosion point was not found in alkaline plating solution, and the particle distribution of the coating was uniform. The Sn content at the corrosion point of the coating is relatively high. It can be inferred that when the coating is corroded, the Cu in the coating is corroded first. 3. The aggregates are spherical in structure and the particles in the coating are regular cube. In the Cu-Sn-B nanocrystalline coating with small particle size below 100nm, the agglomerates are floral, the pellets are elliptical, the short diameter of the pellets is less than 150nmPCu-W-P, the agglomerates are triangular flakes and the side length of the triangulars is less than 100nm.4. The structure of the coating does not change with the change of the technological formula. The Cu-Ni-Pn-Pn- Cu-Sn-BU Cu-W-P coating appears at 43.29 掳Cu ~ (11) C ~ (-1) and Cu ~ (2 +) ~ (200) C ~ (200) 路5 at 50.43 掳. After heat treatment, the agglomerates are more dispersed, the size decreases, the agglomeration edge fuses, and the coating changes from amorphous to crystalline.
【学位授予单位】：湖南师范大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TB383.1

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