化学镀制备Mo-20Cu复合粉末及坯体烧结性能的研究

发布时间：2018-06-09 16:49

  本文选题：Mo-Cu合金 + 化学镀　； 参考：《郑州大学》2015年硕士论文

【摘要】：Mo-Cu合金是一种假性合金,由具有高熔点、低热膨胀系数的Mo和高导电性、高导热性的Cu组成,该合金兼顾了二者的优点。Mo-Cu合金具有性能稳定,耐烧蚀和致密度高的优点,广泛应用于电子封装材料、热沉材料以及航天航空精密仪器零部件,发展前景广阔。本文通过化学镀法制备Mo-Cu复合粉末,利用液相烧结制备Mo-Cu合金,对预处理工艺、化学镀工艺和烧结工艺进行了探讨,通过优化工艺参数制备出具有高致密性和高导电率的复合材料。通过本课题的研究,不仅可以为性能良好的Mo-Cu合金的制备找到一种很好的方法,也为其大批量的生产和广泛的使用提供强有力的保障。Mo粉预处理包括粉末的分散、除油、粗化、敏化和活化五步,提高了Mo粉表面活性,减少了复合粉末团聚现象,大大提高了Mo粉与Cu的结合性能,有利于化学镀的实施。通过对化学镀工艺参数进行探讨,最终确定试验采用的化学镀方案:稳定剂2,2'-联吡啶的浓度为20 mg/L,还原剂甲醛含量24 ml/L,主盐五水硫酸铜的含量为15-20 g/L,p H值为11.5,水浴温度为50℃,络合剂采用乙二酸四乙酸二钠和酒石酸钾钠组成的双络合剂系统,转速为40 r/s。通过对烧结工艺进行探讨,确定烧结温度1150℃,保温90 min。烧结温度对合金的显微组织、致密度、显微硬度和导电性都有显著的影响。对烧结工艺进行优化后,Mo-Cu合金显微组织呈网状结构,致密均匀,没有明显的缺陷;致密度达到96.1%;导电率为44.56%(IACS),导电性能良好;合金的硬度值为179.2 HV。对Mo-Cu合金液相烧结后发现随着温度的升高,合金的致密度、显微硬度、导电率都是呈上升趋势,显微组织也逐渐呈现网状结构。这是由于Cu的流动能力增强,Cu在毛细管力的作用下填充合金中的孔隙,降低了合金中孔隙的数量。但当温度超过1150℃,合金的各项性能指标都在下降。这是因为Cu的流动性较强向外溢出,合金内部出现孔洞。
[Abstract]:Mo-Cu alloy is a pseudo-alloy, which consists of Mo with high melting point, low thermal expansion coefficient and Cu with high electrical conductivity and high thermal conductivity. The Mo-Cu alloy has the advantages of stable properties, high ablation resistance and high density. Widely used in electronic packaging materials, heat sink materials and aerospace precision instrument parts, development prospects. Mo-Cu composite powder was prepared by electroless plating. Mo-Cu alloy was prepared by liquid phase sintering. The pretreatment process, electroless plating process and sintering process were discussed. The composites with high compactness and high conductivity were prepared by optimizing the process parameters. Through the research of this subject, not only can we find a good method for the preparation of Mo-Cu alloy with good properties, but also provide a strong guarantee for its mass production and extensive use. The pretreatment of Mo powder includes powder dispersion, deoiling and coarsening. The surface activity of Mo powder was improved, the agglomeration of composite powder was reduced, the binding property of Mo powder and Cu was greatly improved, and the electroless plating was beneficial to the implementation of electroless plating. Through discussing the technological parameters of electroless plating, the final scheme of electroless plating was determined: the concentration of stabilizer 2O2-bipyridine was 20 mg / L, the formaldehyde content of reductant was 24ml / L, the content of copper sulfate pentahydrate was 15-20 g / L (H = 11.5g / L), the water bath temperature was 50 鈩，

本文编号：2000432