碳纤维表面电镀铜层微观形貌表征及分析

发布时间：2018-06-23 11:06

  本文选题：碳纤维 + 电镀　； 参考：《金属热处理》2017年04期

【摘要】：采用电镀法制备了镀铜短碳纤维,借助扫描电镜(SEM)对镀层微观形貌以及镀层厚度进行了微观表征,并利用X射线光电子能谱(XPS)分析技术对镀层的化学成分和镀层中主要元素化合价态进行了分析。结果表明:经过预处理的碳纤维表面变得粗糙,有很多亲水性含氧官能团;电镀电压2 V,电镀时间20 min,电镀温度30℃时,可获厚度约1.2μm、短碳纤维端头被镀层紧紧包裹的均匀电镀层;镀层中间大部分铜以单质形式存在,表面镀铜层被氧化成氧化铜,镀层仿形生成,与碳纤维形成一个紧密的镶嵌体系。
[Abstract]:Copper coated short carbon fiber was prepared by electroplating. The microstructure and thickness of the coating were characterized by scanning electron microscopy (SEM). The chemical composition of the coating and the valence states of the main elements in the coating were analyzed by X-ray photoelectron spectroscopy (XPS). The results show that the surface of the pretreated carbon fiber becomes rough and has many hydrophilic oxygen functional groups, the electroplating voltage is 2 V, the electroplating time is 20 min, and the electroplating temperature is 30 鈩，

本文编号：2056914