乙酸溶液中电沉积法制备纳米晶铜组织和结晶特征（英文）

发布时间：2018-06-27 21:41

本文选题：乙酸盐 + 铜电沉积　；参考：《Transactions of Nonferrous Metals Society of China》2017年06期

【摘要】：在传统硫酸沉积铜中甲烷磺酸是一种可选择的电解液。从环境友好的乙酸基电解液中电沉积铜,该电解液由乙酸铜、乙酸钠、甲烷磺酸组成。采用维生素、糖精和4-氨基-3-羟基-1-磺酸作为沉积电解液的添加剂,利用法拉第定律计算阴极电流效率,并使用Haring-Blum电池确定溶液中的金属分布比。这些添加剂影响了沉积铜薄膜的表面形貌,采用SEM和XRD手段分析其晶粒尺寸。XRD谱表明电沉积铜是多晶面心立方体结构。采用Debye-Scherrer公式计算薄膜的晶粒大小。晶体尺寸表明含电解液添加剂沉积得到的产物具有最小的晶粒尺寸。织构系数分析表明,所有的铜沉积膜都是多晶结构,晶体择优取向并平行于表面。添加剂导致了均匀的无针孔表面形貌和晶粒细化。
[Abstract]:Methane sulfonic acid is an optional electrolyte in traditional copper deposition with sulfuric acid. Copper was electrodeposited from an environmentally friendly acetic acid electrolyte consisting of copper acetate, sodium acetate and methane sulfonic acid. Vitamin, saccharin and 4-amino-3-hydroxy-1-sulfonic acid were used as additives for deposition electrolyte. The cathodic current efficiency was calculated by Faraday's law, and the metal distribution ratio in solution was determined by Haring-Blum battery. These additives affect the surface morphology of the deposited copper thin films. The grain size. XRD spectra show that the electrodeposition of copper is a polycrystalline cubic structure. Debye-Scherrer formula was used to calculate the grain size of the films. The crystal size indicates that the product deposited with electrolyte additive has the smallest grain size. Texture coefficient analysis shows that all copper films are polycrystalline with preferred orientation and parallel to the surface. The additive resulted in uniform pinhole free surface morphology and grain refinement.
【作者单位】： Electroplating
【分类号】：TB383.1;TF811

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