树脂基导热复合材料的制备与性能研究
发布时间：2018-12-28 14:03
【摘要】：随着微电子信息技术的逐渐发展,传统的电子元器件正逐步向着高精度、高集成方向发展,这就意味着电子设备在单位体积上产生更多的热量。为了保障电子设备可以高效长久的工作,能否及时的把器件产生的热量散出便成了至关重要的因素,填充型树脂基导热复合材料正是基于这个因素逐渐发展起来的。本论文以氧化铝(Al2O3)、氧化石墨烯(GO)为导热填料,以环氧树脂为基体,以碳纤维布(CF)和玄武岩纤维/碳纤维合股布(BF/CF)为增强材料,分别制备了导热树脂基浇铸体和导热树脂基层压板。为了改善Al2O3填料与树脂基体的相容性和界面结合强度,通过两步改性对Al2O3填料进行处理:先使用偶联剂处理引入环氧基官能团(Al2O3-KH560),在改性后的粒子上接枝低分子聚酰胺引入氨基官能团(Al2O3-PA650)。接着使用红外和热失重对改性后的填料进行表征。使用未处理的Al2O3粒子、Al2O3-KH560粒子和Al2O3-PA650粒子三种不同表面特性的填料填充环氧树脂制备导热复合材料。采用导热仪、热失重分析仪、扫描电子显微镜和万能试样机等设备研究复合材料的导热性能、力学性能和形貌。结果表明:Al2O3-PA650粒子在环氧树脂中的分散性最好。三种复合材料的导热系数都随填料使用量的增大而增大。当填充量相等时,Al2O3-PA650/环氧树脂复合材料的导热性能和力学性能最好。此外,通过加入微量氧化石墨烯与Al2O3-PA650粒子复配使用,极大的改善了复合材料的导热性能和力学性能。当使用1 wt%GO和30 wt%Al2O3-PA650复配使用时,复合材料的导热系数可达0.61W/mK,比纯环氧树脂的0.237 W/mK提升了157%。以导热填料的表面改性为基础,制备并研究了碳纤维布和玄碳合股布增强填充型环氧树脂层压板的导热性能与力学性能。系统的探讨了不同Al2O3-PA650填料添加量对两种不同特性的纤维布增强环氧树脂层压板的综合性能的影响。结果显示:两种纤维布增强环氧树脂层压板的纵向和横向导热系数都随氧化铝填料含量的增大而呈先增加后减少的趋势。当Al2O3-PA650使用量为30 wt%时,两种层压板的纵向导热系数差别最大,分别为1.05 W/mK和0.61 W/mK。碳纤维布增强环氧树脂层压板的力学性能整体好于玄碳合股布增强环氧层压板,且两者随填料含量的变化规律基本一致。
[Abstract]:With the development of microelectronic information technology, traditional electronic components are gradually developing towards high precision and high integration, which means that electronic devices produce more heat per unit volume. In order to ensure that electronic equipment can work efficiently and for a long time, whether or not the heat produced by the device can be dissipated in time becomes a crucial factor, and it is based on this factor that the filled resin matrix thermal conductivity composite material is gradually developed. In this paper, alumina (Al2O3), graphene oxide (GO) as thermal conductive filler, epoxy resin as matrix, carbon fiber sheet (CF) and basalt fiber / carbon fiber composite (BF/CF) as reinforcements. Heat-conducting resin-based casting bodies and heat-conducting resin base compaction plates were prepared respectively. In order to improve the compatibility and interfacial bonding strength of Al2O3 filler with resin matrix, the Al2O3 filler was treated by two steps of modification: first, the epoxy functional group (Al2O3-KH560) was introduced by coupling agent treatment. The modified particles were grafted with low molecular polyamide to introduce amino functional group (Al2O3-PA650). The modified filler was characterized by IR and TG. Epoxy resin filled with untreated Al2O3 particles, Al2O3-KH560 particles and Al2O3-PA650 particles with different surface characteristics was used to prepare thermal conductivity composites. The thermal conductivity, mechanical properties and morphology of the composites were studied by means of thermal conductivity instrument, thermogravimetric analyzer, scanning electron microscope and universal specimen machine. The results show that the dispersion of Al2O3-PA650 particles in epoxy resin is the best. The thermal conductivity of the three composites increases with the increase of filler content. The thermal conductivity and mechanical properties of Al2O3-PA650/ epoxy resin composites are the best when the filling amount is equal. In addition, the thermal conductivity and mechanical properties of the composites were greatly improved by adding trace graphene oxide and Al2O3-PA650 particles. When 1 wt%GO and 30 wt%Al2O3-PA650 were used, the thermal conductivity of the composite was 0.61W / mK, which was 157mm higher than that of pure epoxy resin (0.237 W/mK). Based on the surface modification of thermal conductive filler, the thermal conductivity and mechanical properties of epoxy resin laminates reinforced by carbon fiber cloth and metacronal fabric were studied. The effects of different Al2O3-PA650 fillers on the comprehensive properties of two kinds of fiber cloth reinforced epoxy resin laminates were studied systematically. The results show that the longitudinal and transverse thermal conductivity of the two fiber cloth reinforced epoxy resin laminates increase first and then decrease with the increase of alumina filler content. When the amount of Al2O3-PA650 was 30 wt%, the difference of longitudinal thermal conductivity between the two laminates was 1.05 W/mK and 0.61 W / mK, respectively. The mechanical properties of carbon fiber reinforced epoxy laminates are better than that of metacrylonitrile reinforced epoxy laminates.
【学位授予单位】：哈尔滨工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TB332
[Abstract]:With the development of microelectronic information technology, traditional electronic components are gradually developing towards high precision and high integration, which means that electronic devices produce more heat per unit volume. In order to ensure that electronic equipment can work efficiently and for a long time, whether or not the heat produced by the device can be dissipated in time becomes a crucial factor, and it is based on this factor that the filled resin matrix thermal conductivity composite material is gradually developed. In this paper, alumina (Al2O3), graphene oxide (GO) as thermal conductive filler, epoxy resin as matrix, carbon fiber sheet (CF) and basalt fiber / carbon fiber composite (BF/CF) as reinforcements. Heat-conducting resin-based casting bodies and heat-conducting resin base compaction plates were prepared respectively. In order to improve the compatibility and interfacial bonding strength of Al2O3 filler with resin matrix, the Al2O3 filler was treated by two steps of modification: first, the epoxy functional group (Al2O3-KH560) was introduced by coupling agent treatment. The modified particles were grafted with low molecular polyamide to introduce amino functional group (Al2O3-PA650). The modified filler was characterized by IR and TG. Epoxy resin filled with untreated Al2O3 particles, Al2O3-KH560 particles and Al2O3-PA650 particles with different surface characteristics was used to prepare thermal conductivity composites. The thermal conductivity, mechanical properties and morphology of the composites were studied by means of thermal conductivity instrument, thermogravimetric analyzer, scanning electron microscope and universal specimen machine. The results show that the dispersion of Al2O3-PA650 particles in epoxy resin is the best. The thermal conductivity of the three composites increases with the increase of filler content. The thermal conductivity and mechanical properties of Al2O3-PA650/ epoxy resin composites are the best when the filling amount is equal. In addition, the thermal conductivity and mechanical properties of the composites were greatly improved by adding trace graphene oxide and Al2O3-PA650 particles. When 1 wt%GO and 30 wt%Al2O3-PA650 were used, the thermal conductivity of the composite was 0.61W / mK, which was 157mm higher than that of pure epoxy resin (0.237 W/mK). Based on the surface modification of thermal conductive filler, the thermal conductivity and mechanical properties of epoxy resin laminates reinforced by carbon fiber cloth and metacronal fabric were studied. The effects of different Al2O3-PA650 fillers on the comprehensive properties of two kinds of fiber cloth reinforced epoxy resin laminates were studied systematically. The results show that the longitudinal and transverse thermal conductivity of the two fiber cloth reinforced epoxy resin laminates increase first and then decrease with the increase of alumina filler content. When the amount of Al2O3-PA650 was 30 wt%, the difference of longitudinal thermal conductivity between the two laminates was 1.05 W/mK and 0.61 W / mK, respectively. The mechanical properties of carbon fiber reinforced epoxy laminates are better than that of metacrylonitrile reinforced epoxy laminates.
【学位授予单位】：哈尔滨工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TB332
【参考文献】
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