氮化硼和纳米金刚石混杂填充聚酰亚胺导热复合材料的制备与表征

发布时间：2019-01-06 16:08

【摘要】：以二维六方氮化硼和三维纳米金刚石为导热填料通过原位聚合方式杂化填充到聚酰亚胺(PI)基体中制备导热绝缘复合材料。采用聚芳酰胺和4,4-二氨基二苯醚分别对氮化硼和纳米金刚石进行表面接枝改性,以提高有机-无机两相界面的相容性。通过扫描电子显微镜、导热仪、热重分析等方法对复合材料的结构和性能进行了表征。结果表明,不同粒径的导热填料混杂填充聚合物,利用协同效应可以提高堆砌密度,降低界面热阻,形成导热网络。当填料总质量分数为30%,改性氮化硼和纳米金刚石的质量比为9∶1时,复合材料的热导率达0.596 W/(m·K),是纯PI的3.5倍,同时复合材料仍具有较好的热稳定性和电绝缘性,满足微电子领域的应用需求。
[Abstract]:Two dimensional hexagonal boron nitride and three dimensional nanocrystalline diamond were used as thermal conductors to prepare thermal insulating composites by in-situ polymerization hybrid filling into polyimide (PI) matrix. The surface grafting of boron nitride and nanocrystalline diamond was carried out by using polyarylamides and 4-diaminodiphenyl ether, respectively, in order to improve the compatibility of the interface between organic and inorganic phases. The structure and properties of the composites were characterized by scanning electron microscopy, thermal conductivity and thermogravimetric analysis. The results show that the synergistic effect can increase the density of the stack, reduce the thermal resistance of the interface and form the thermal conductivity network. When the total mass fraction of filler is 30 and the mass ratio of modified boron nitride and nanocrystalline diamond is 9:1, the thermal conductivity of the composite is 0.596 W / (m K), which is 3. 5 times of that of pure PI. At the same time, the composite still has good thermal stability and electrical insulation to meet the application needs in the field of microelectronics.
【作者单位】：河北工业大学高分子科学与工程研究所;承德石油高等专科学校;
【基金】：河北省自然科学基金资助项目(E2016202036) 国家自然科学基金资助项目(51573037)
【分类号】：TB332

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