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达迈研发新型PI薄膜——SkinTran

发布时间:2019-01-17 13:27
【摘要】:正达迈科技的研发团队开发出一款新型超薄PI膜(厚度1~5μm)Skin Tran,可应用于超薄型覆盖膜及软性铜箔基层板,在维持原有制程并控制良好的成本效益下,完成轻量化、低反弹力软板之制造。另外,延续2016 TPCA展出的毫米结构识别PI膜(tPI),达迈科技在2017年藉由独特的PI制模技术,开发出具有微米结构的PI机能膜材。在显示与照明领域中,可提供做为光学扩散及增亮的用途。
[Abstract]:The R & D team of Zhengdamai Technology has developed a new ultra-thin PI film (1 ~ 5 渭 m) Skin Tran, thickness) which can be used in ultra-thin covering film and soft copper foil base plate, which can be lightweight under the condition of maintaining the original process and controlling the cost efficiency. Manufacturing of soft plates with low rebound strength. In addition, the millimeter structure recognition PI film (tPI), Damai Technology, which continues to be on display at 2016 TPCA, developed the PI functional membrane with micron structure in 2017 with the unique PI moulding technology. In the field of display and lighting, it can be used for optical diffusion and enhancement.
【分类号】:TB383.2


本文编号:2410102

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