一款高性能开关电源芯片的修调方案分析与设计

发布时间：2018-01-06 21:27

本文关键词：一款高性能开关电源芯片的修调方案分析与设计　出处：《电子科技大学》2014年硕士论文　论文类型：学位论文

【摘要】：对于模拟电路,芯片一经流片,电路的相关特性就已确定而无法更改。然而,受到工艺环境等非理想因素影响,一些参数并不符合设计预期,导致流片后芯片的精度及性能与预期相差甚远。为了弥补电路设计期望与芯片最终性能之间的差距,近年来,针对大规模集成电路的修调技术不断得到发展。与此同时,开关电源芯片也正朝着高性能、高精度、小体积以及低成本的方向发展,因此采用合适的修调手段对电源芯片进行修调十分必要。本论文针对一款开关电源芯片设计项目,为芯片制定修调方案并完成电路设计。论文首先对修调的原理、作用以及几种常用的修调方法进行了介绍。之后,文章介绍了本开关电源芯片的特点、内部结构以及典型应用。根据芯片的特点及结构,找出容易受工艺影响的关键参数,并在相关的电路中加入修调电路。针对本芯片,本文设计了两种不同的修调方案。本文首先设计了一种金属熔丝修调方案。金属熔丝修调的好处是成本低廉,并且与标准工艺兼容性极佳。本文完成了这一方案的电路设计,并通过模拟熔丝通断状态对电路进行仿真,验证了电路功能的正确性。由于金属熔丝修调在封装之前进行,无法避免封装给芯片造成的影响,因此,本文设计了另一种更为精确的修调方案——二极管反熔丝修调方案。二极管修调可以在封装后进行,因此修调精度更高。然而,通常情况下,芯片封装后修调只能利用芯片为正常应用而设计的引脚完成。根据这一特点,本文仅利用芯片的6个功能引脚,完成修调方案的电路设计。在该方案中,本文还针对芯片重要参数,进行了“预修调”的电路设计,即在不破坏熔丝的情况下,模拟熔丝状态改变后对相关电路参数变化的影响。通过预修调,找出最佳的修调组合,之后再对相应的熔丝进行修调操作。通过对电路的功能进行仿真,验证了电路设计的正确性。文章最后对两种修调方式进行了比较,上述两种方案各有优缺点,方案的选择需要综合考虑工艺条件、精度要求以及成本等因素。
[Abstract]:For analog circuits, once the chip flow chip, the circuit characteristics have been determined and can not be changed. However, due to the process environment and other non-ideal factors, some parameters do not meet the design expectations. In order to make up for the gap between the design expectation and the final performance of the chip, the precision and performance of the chip behind the chip are far from expected in recent years. At the same time, switching power supply chips are developing towards high performance, high precision, small volume and low cost. Therefore, it is necessary to modify the power supply chip by the appropriate adjustment means. This paper aims at a switch power supply chip design project. Firstly, this paper introduces the principle, function and several common modification methods of the modification. Then, this paper introduces the characteristics of the switch power supply chip. Internal structure and typical applications. According to the characteristics and structure of the chip, find out the key parameters easy to be affected by the process, and add the correction circuit to the related circuit. In this paper, two different modification schemes are designed. Firstly, a metal fuse modification scheme is designed. The advantages of metal fuse modification are low cost. And the compatibility with the standard process is very good. This paper completes the circuit design of this scheme, and simulates the circuit by simulating the fuse on-off state. The correctness of the circuit function is verified. Because the metal fuse is modified before the package, it is impossible to avoid the impact of the package on the chip. In this paper, another more precise modification scheme, diode anti-fuse modification, is designed. Diode modification can be carried out after packaging, so the modification accuracy is higher. However, in general, it is more accurate. Only the pin designed for normal application can be used to complete the modification after chip packaging. According to this characteristic, this paper only uses the six functional pins of the chip to complete the circuit design of the modification scheme. According to the important parameters of the chip, the circuit design of "pre-trimming" is carried out, that is, without destroying the fuse, the influence of the change of the fuse state on the change of the related circuit parameters is simulated. Find out the best adjustment combination, and then adjust the corresponding fuse operation. Through the simulation of the circuit function, verify the correctness of the circuit design. Finally, the two modification methods are compared. The above two schemes have their own advantages and disadvantages, and the selection of the scheme needs to consider the process conditions, precision requirements and cost factors.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN86

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