低压成套开关设备内部环境温度的测试与分析

发布时间：2018-01-10 02:24

本文关键词：低压成套开关设备内部环境温度的测试与分析　出处：《大连理工大学》2015年硕士论文　论文类型：学位论文

【摘要】：本文首先对低压成套开关设备进行了简单的介绍,说明低压成套开关设备的发展方向,声明了热问题对低压成套开关设备的影响,表明了研究热问题对低压成套开关设备的重要性。引入低压成套开关设备检测的国家标准,讲解检测标准的换版历史,说明我国低压成套开关设备检测行业的现状,以及检测过程中存在的问题和矛盾：落后检测方法,无法适应高新科技产品的检测需求,人力电力损耗巨大。为了解决该问题和矛盾,本文尝试性的提出用模拟仿真方法代替传统的温升型式试验方法。最终引出本课题研究对象——低压成套开关设备的温升型式试验问题。针对低压成套开关设备的温升型式试验问题,提出温度场的概念,构建低压成套开关设备温度场的有限元分析数学模型,讲解传热学的基本理论,说明稳态温度场的热微分方程,最后说明低压成套开关设备温度场分析的有限元法。使用ANSYS14.0软件对低压成套开关设备的温升型式试验进行仿真试验,构建XL-21型低压成套开关设备的三维实体模型,划分网格,施加载荷,数据计算,得出仿真数据。严格按照国家标准的要求,使用先进的电流发生装置,对XL型低压成套开关设备进行温升型式试验,使用GP20型便携式无纸记录仪对温度进行监控和采集,得出试验数据。把仿真数据同试验数据进行比较,说明低压成套开关设备温升型式试验仿真试验方法的可行性。
[Abstract]:This paper first introduces the low-voltage switchgear, explains the development direction of the low-voltage switchgear, and states the influence of the heat problem on the low-voltage switchgear. This paper shows the importance of studying heat problem to low voltage switchgear, introduces the national standard of low voltage switchgear testing, and explains the history of test standard change. Explain the current situation of the low-voltage switchgear testing industry in our country, and the problems and contradictions in the testing process: backward detection methods, can not meet the testing needs of high-tech products. The manpower power consumption is huge. In order to solve this problem and contradiction. In this paper, we try to replace the traditional temperature rise type test method with the simulation method. Finally, the problem of the temperature rise type test of the low voltage switchgear is brought out. In view of the low voltage complete switchgear, the temperature rise type test problem of the low voltage switchgear is introduced. The temperature rise type test problem. The concept of temperature field is put forward, the finite element analysis mathematical model of temperature field of low voltage switchgear is constructed, the basic theory of heat transfer is explained, and the thermal differential equation of steady state temperature field is explained. Finally, the finite element method for temperature field analysis of low voltage switchgear is introduced. The temperature rise type test of low voltage switchgear is simulated by using ANSYS14.0 software. The three-dimensional solid model of XL-21 type low-voltage switchgear is constructed, the grid is divided, the load is applied, the data is calculated, and the simulation data is obtained. According to the requirements of the national standard, advanced electric current generating devices are used. The temperature rise type test of XL low voltage switchgear is carried out, and the temperature is monitored and collected by GP20 portable paperless recorder, and the test data are obtained. The simulation data are compared with the test data. The feasibility of simulation test method for temperature rise type test of low voltage switchgear is explained.
【学位授予单位】：大连理工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TM643

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