基于COB封装结构功率LED热仿真研究

发布时间：2018-04-10 18:37

本文选题：封装结构 + 功率LED　；参考：《哈尔滨理工大学》2014年硕士论文

【摘要】：随着科学技术的不断发展进步，人类在照明领域的发展空前繁荣。从上世纪末开始，随着半导体技术日益成熟，LED照明在节能环保、提高照明质量和效率方面表现出了巨大优势，，其应用也越来越广泛。LED器件的封装作为半导体照明产业链的中游环节，封装的功能在于提供芯片足够的保护，防止芯片在空气中长期暴露或机械损伤而失效，以提高芯片的稳定性。好的封装可以让LED具备更好的发光效率和散热环境，进而提升LED的寿命。本文通过Pro/E和有限元分析软件ANSYS的联合模拟仿真，对市场上比较普遍而且封装技术比较成熟功率LED的SMD和COB两种封装结构进行了热仿真与热分析。主要完成的工作如下：首先，本文是从功率型LED的热特性入手，对轴对称功率型LED封装结构做了深入的调研工作，详细论述了本课题的研究目的与意义以及未来的发展趋势。对热传递、热传导以及热学模型进行了理论阐述。针对功率型LED高度集成密封在不影响封装结构前提下提出采用大电流测试结温方法，为获得准确的实验数据提供支持。其次，伴随功率型LED的新型封装技术不断发展，介绍了SMD和COB两种封装结构。本文分别通过选用SMD封装和COB封装两种常见结构的功率型LED样品作为实例。运用大电流测试结温的方法对LED样品的两种结封装结构进行试验数据采集分析，并与通过ANSYS软件仿真模拟的结果进行对比，以验证通过ANSYS软件建立模型和分析的准确性。最后，本文利用Pro/E和有限元分析软件ANSYS的联合对COB封装结构依据不同传导路径得三种不同的形式进行对比仿真分析，之后通过散热器增长再进行量化分析。伴随着功率型LED产品通过垂直方向上内部热沉数量的减少，其热传导所经过的路径也在减少，对于传导路径经过的地方越少，则对应散热效果就越好；通过将COB-A与COB-B的散热器分别增长原来各自散热器的187.5%和32.5%才可以达到与COB-C接近的散热效果，这样我们通过改变传导路径来改变散热效果，不但成本低廉，更加实用。
[Abstract]:With the development of science and technology, the development of mankind in the field of lighting unprecedented prosperity.Since the end of the last century, with the increasingly mature semiconductor technology, LED lighting has shown great advantages in energy saving, environmental protection, lighting quality and efficiency.The packaging of LED devices is becoming more and more widely used as the middle link of the semiconductor lighting industry chain. The function of the packaging is to provide adequate protection of the chip against long-term exposure to the air or mechanical damage and failure.To improve the stability of the chip.Good encapsulation allows LED to have better luminous efficiency and heat dissipation environment, thus increasing the lifetime of LED.Through the joint simulation of Pro/E and the finite element analysis software ANSYS, the thermal simulation and thermal analysis of two packaging structures, SMD and COB, which are more popular in the market and more mature in power LED, are carried out in this paper.The main tasks accomplished are as follows:Firstly, starting with the thermal characteristics of power type LED, this paper makes a deep investigation on the axisymmetric power type LED packaging structure, and discusses in detail the purpose, significance and future development trend of this topic.The heat transfer, heat conduction and thermal model are discussed theoretically.In view of the high integrated seal of power type LED without affecting the package structure, a method of high current measurement of junction temperature is proposed, which provides support for obtaining accurate experimental data.Secondly, with the development of new packaging technology of power LED, two kinds of packaging structures, SMD and COB, are introduced.In this paper, the power type LED samples with two common structures, SMD package and COB package, are selected as examples.Two kinds of junction packaging structures of LED samples were collected and analyzed by using the method of high current test junction temperature, and the results were compared with the results of simulation by ANSYS software to verify the accuracy of modeling and analysis by ANSYS software.Finally, the paper uses the combination of Pro/E and the finite element analysis software ANSYS to compare and simulate the COB packaging structure according to different conduction paths, and then carries on the quantitative analysis through the radiator growth.With the decrease of the quantity of heat sink in the vertical direction, the heat conduction path of the power type LED product is also decreasing. The less the place of the conduction path, the better the heat dissipation effect.By increasing the radiators of COB-A and COB-B by 187.5% and 32.5% of the original radiators respectively, the heat dissipation effect close to that of COB-C can be achieved. In this way, we can change the heat dissipation effect by changing the conduction path, which is not only low cost, but also more practical.
【学位授予单位】：哈尔滨理工大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TM923.34

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