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大功率LED路灯驱动电路设计及散热分析

发布时间:2018-11-04 17:48
【摘要】:作为新型的半导体照明器件,LED具有节能环保、寿命长、无污染、色彩丰富等优点,使其在医疗、车用、景观和道路照明等方面发展迅速。制约大功率LED路灯发展的主要因素是其散热问题,本文设计了一款200W大功率LED路灯驱动,并对其进行了合理的热设计,同时通过热仿真研究其各元件的工作环境温度及驱动电路的温度分布,最后对MOSFET的散热器进行了优化设计 本文在给出了大功率LED路灯选题背景,介绍了LED的优点及LED路灯的发展现状及趋势后,阐述了LED驱动的设计要求及设计重点,由于大功率LED路灯的发热量较大,因此在进行LED路灯设计时需着重考虑大功率LED驱动的热设计,保证室外温度变化及自发热对驱动电路寿命及可靠性的影响最小。 其次本文给出了200W大功率LED路灯驱动电路的设计,采用NCP1607作为驱动的控制IC,产生PWM波控制MOSFET,并对电路进行功率因数校正。为满足隔离降压的目的,选择正激式变换器作为主电路拓扑,同时电路的设计还包括浪涌保护、EMI滤波电路、稳压电路以及输出反馈的设计等。 由于LED的寿命和亮度都与温度有关,因此热设计时LED路灯驱动设计的重点。在给出了大功率LED路灯驱动热设计的要求和注意事项后,分析对比了几种散热方式。本文的散热设计主要集中在元件选型和散热方式的选择两方面。 论文最后,通过Flotherm软件对基于NCP1607的大功率正激LED驱动电源进行了散热仿真,验证散热器对于大功率LED路灯驱动散热的必要性和有效性,仿真的数据结果显示散热器能有效地降低LED驱动的工作温度,同时对热源处的散热器进行了优化,对比优化前后的温度数据可以看出,MOSFET的结温和工作温度得到了进一步的降低。
[Abstract]:As a new type of semiconductor lighting device, LED has the advantages of energy saving, environmental protection, long life, no pollution, rich color and so on, which makes it develop rapidly in medical, vehicle, landscape and road lighting. The main factor restricting the development of high power LED street lamp is its heat dissipation. A 200W high power LED street lamp driver is designed in this paper, and a reasonable thermal design is carried out. At the same time, the working environment temperature of each component and the temperature distribution of driving circuit are studied by thermal simulation. Finally, the optimization design of MOSFET radiator is carried out. In this paper, the background of high power LED street lamp is given. After introducing the advantages of LED and the development status and trend of LED street lamp, the design requirements and key points of LED drive are expounded. Because of the high power LED street lamp, the heat output is larger. Therefore, the thermal design of high power LED drive should be taken into account in the design of LED street lamp, and the influence of outdoor temperature change and self-heating on the life and reliability of the drive circuit should be minimized. Secondly, the design of 200W high power LED street lamp driving circuit is given. The NCP1607 is used as the driver to generate PWM wave to control MOSFET, and power factor correction is carried out. In order to satisfy the purpose of isolating and lowering voltage, forward converter is chosen as the main circuit topology. The circuit design also includes surge protection, EMI filter circuit, voltage stabilizer circuit and output feedback design. Because the lifetime and brightness of LED are related to temperature, the emphasis of LED streetlight drive design is thermal design. In this paper, the requirements and points for attention of high power LED street lamp driving heat design are given, and several heat dissipation modes are analyzed and compared. The design of heat dissipation in this paper mainly focuses on the selection of components and the selection of heat dissipation mode. Finally, the heat dissipation simulation of high power forward LED driving power supply based on NCP1607 is carried out by Flotherm software, and the necessity and effectiveness of radiator for high power LED street lamp driving heat dissipation are verified. The simulation results show that the radiator can effectively reduce the working temperature driven by LED. At the same time, the radiator at the heat source is optimized. By comparing the temperature data before and after the optimization, it can be seen, The junction temperature of MOSFET is further reduced.
【学位授予单位】:大连理工大学
【学位级别】:硕士
【学位授予年份】:2014
【分类号】:TM923.34

【参考文献】

相关期刊论文 前10条

1 王舒;阮新波;姚凯;叶志红;;无电解电容无频闪的LED驱动电源[J];电工技术学报;2012年04期

2 樊永隆;;反激式变换器中RCD箝位电路的设计[J];电源技术应用;2006年12期

3 张文嘉;钟海峰;王剑斌;;MOSFET的驱动及吸收电路[J];电脑知识与技术;2009年21期

4 赵舒泽;陈申;吕征宇;;基于NCP1607的自驱动Boost PFC的设计[J];电源学报;2011年01期

5 王莹;;LED驱动器与功率芯片发展趋势[J];电子产品世界;2011年04期

6 张忠海;电子设备中高功率器件的强迫风冷散热设计[J];电子机械工程;2005年03期

7 曹丽萍;张勋;陈晨;刘韬;;开关电源输入EMI滤波器设计与仿真[J];电子科技;2010年04期

8 田传军;张希艳;邹军;王妍彦;;温度对大功率LED照明系统光电参数的影响[J];发光学报;2010年01期

9 沙占友;王彦朋;;功率开关管及LED驱动芯片的散热器设计[J];电源技术应用;2012年07期

10 陈海路;胡书春;王男;林志坚;夏根培;刘闻凤;任凯旋;冀磊;单春丰;;大功率LED器件散热技术与散热材料研究进展[J];功能材料;2013年S1期



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