太阳能电池用低温固化银浆的制备及性能研究
发布时间：2018-11-06 12:52
【摘要】：摘要：低温固化型导电银浆是一种特殊添加型导体浆料,一般由基体树脂粘结相、导电功能相、有机溶剂及其他助剂组成,其优良的电性能以及在较低温度下固化的特点适用于HIT太阳能电池的正面和背面的电极。本文以低温固化型导电浆料的原料制备和固化工艺为研究对象,主要内容包括微细银粉的制备、片状银粉的化学还原-机械球磨法制备和理论探讨、环氧树脂的固化工艺参数的优化以及浆料的合成和性能检测,同时研究浆料各组分对导电性能的影响,研究结果如下： (1)以保护剂(PVP)+表面活性剂(吐温-80)为二元分散体系制备微细球形银粉,PVP能与Ag+形成配合物促进形核,吐温-80分子通过吸附作用抑制晶核过快生长,二元分散体系能够在空间和时间上产生协同作用,有效加强空间位阻效应；同时改变还原液和银液的PH,银粒子粒径降低的速度更快更均匀,可以有效控制银粉的粒径。反应体系的最佳PH为5。调节PVP和吐温-80的配比和用量,当m(吐温-80+PVP)/m(AgNO3)为0.03时制备的银粉分散性良好,平均粒径为1.25μm,振实密度达4.6g/cm3,XRD结果表明银粉具有很高的纯度。 (2)球状银粉相比于树枝状银粉和类球状银粉球磨效果更好,在制备工艺上更容易控制,有利于片状银粉的制备。HLB值小的表面活性剂与HLB值大的表面活性剂混合使用后,彼此的亲水基团和亲油基团相互配合,分散作用增强,保护效果较好,本文选取司盘-80和吐温-80复配使用,当复合表面活性剂体系的HLB值为6时,体系的分散和保护作用最佳,银粉的松装密度低至1.65g/cm3,比表面积为2.85m2/g,从SEM图片可看出银粉径厚比较高,成片性较好,银粉的片径均匀。 (3)采用差示扫描量热DSC法研究了双酚A型环氧树脂E-51固化工艺,从热力学角度对环氧树脂的固化度进行分析,最终确定最佳固化剂用量为8wt%；对不同升温速率下环氧树脂固化过程的特征温度进行先行拟合,采用外推法求得固化体系的等温固化温度,并确定最佳固化温度确定为160℃。 (4)将片状银粉配制成低温固化型导电浆料,探索了环氧树脂E-51/QNP1固化剂体系条件下的最佳固化工艺,在固化温度160℃,固化时间25±1min条件下银片的相互搭界到了比较好的程度,形成良好的导电网络,电阻率为3.2×10-4Ω·cm,潜伏期为20-30天,电性能满足HIT太阳能电池应用要求。全文
[Abstract]:Abstract: low temperature solidified conductive silver paste is a special additive type of conductive paste, which is generally composed of matrix resin bonded phase, conductive functional phase, organic solvent and other auxiliaries. Its excellent electrical properties and solidification at low temperature are suitable for the front and back electrodes of HIT solar cells. In this paper, the raw material preparation and curing process of low temperature solidified conductive paste are studied. The main contents include the preparation of fine silver powder, the preparation of sheet silver powder by chemical reduction-mechanical ball milling method and the theoretical discussion. The optimization of curing process parameters of epoxy resin, the synthesis and performance testing of the slurry, and the influence of the various components of the slurry on the electrical conductivity of the epoxy resin were studied. The results are as follows: (1) using the protective agent (PVP) surfactant (Tween-80) as binary dispersion system to prepare microsphere silver powder, PVP can form complex with Ag to promote nucleation. Tween-80 molecule can inhibit the rapid growth of crystal nucleus through adsorption, and the binary dispersion system can produce synergistic effect in space and time, and effectively strengthen the steric resistance effect. At the same time, the particle size of PH, silver particles decreased faster and more evenly by changing the reduction solution and silver solution, and the particle size of silver powder could be effectively controlled. The optimum PH of the reaction system is 5. When m (Tween-80 PVP) / m (AgNO3) is 0.03, the silver powder prepared by adjusting the ratio and dosage of PVP and Tween-80 has good dispersion, the average particle size is 1.25 渭 m, and the vibrational density is 4.6 g / cm ~ (-3). XRD results showed that silver powder had high purity. (2) compared with dendritic silver powder and globular silver powder, the ball silver powder has better milling effect and is easier to control in the preparation process, which is beneficial to the preparation of silver flake powder. When the surfactant with small HLB value is mixed with the surfactant with high HLB value, The hydrophilic group and oil group cooperate with each other, the dispersion is enhanced and the protective effect is better. In this paper, the compound of Span-80 and Tween-80 is selected, when the HLB value of the composite surfactant system is 6, The loose density of silver powder is as low as 1.65 g / cm ~ (-3) and the specific surface area is 2.85 m2 / g. From the SEM images, we can see that the diameter of silver powder is high, the lamination property is good, and the diameter of silver powder is uniform. (3) the curing process of bisphenol A epoxy resin E-51 was studied by differential scanning calorimetry (DSC). The curing degree of epoxy resin was analyzed from the point of view of thermodynamics. The characteristic temperature of curing process of epoxy resin at different heating rates was first fitted, and the isothermal curing temperature of the curing system was obtained by extrapolation method, and the optimum curing temperature was determined to be 160 鈩，
本文编号：2314340
[Abstract]:Abstract: low temperature solidified conductive silver paste is a special additive type of conductive paste, which is generally composed of matrix resin bonded phase, conductive functional phase, organic solvent and other auxiliaries. Its excellent electrical properties and solidification at low temperature are suitable for the front and back electrodes of HIT solar cells. In this paper, the raw material preparation and curing process of low temperature solidified conductive paste are studied. The main contents include the preparation of fine silver powder, the preparation of sheet silver powder by chemical reduction-mechanical ball milling method and the theoretical discussion. The optimization of curing process parameters of epoxy resin, the synthesis and performance testing of the slurry, and the influence of the various components of the slurry on the electrical conductivity of the epoxy resin were studied. The results are as follows: (1) using the protective agent (PVP) surfactant (Tween-80) as binary dispersion system to prepare microsphere silver powder, PVP can form complex with Ag to promote nucleation. Tween-80 molecule can inhibit the rapid growth of crystal nucleus through adsorption, and the binary dispersion system can produce synergistic effect in space and time, and effectively strengthen the steric resistance effect. At the same time, the particle size of PH, silver particles decreased faster and more evenly by changing the reduction solution and silver solution, and the particle size of silver powder could be effectively controlled. The optimum PH of the reaction system is 5. When m (Tween-80 PVP) / m (AgNO3) is 0.03, the silver powder prepared by adjusting the ratio and dosage of PVP and Tween-80 has good dispersion, the average particle size is 1.25 渭 m, and the vibrational density is 4.6 g / cm ~ (-3). XRD results showed that silver powder had high purity. (2) compared with dendritic silver powder and globular silver powder, the ball silver powder has better milling effect and is easier to control in the preparation process, which is beneficial to the preparation of silver flake powder. When the surfactant with small HLB value is mixed with the surfactant with high HLB value, The hydrophilic group and oil group cooperate with each other, the dispersion is enhanced and the protective effect is better. In this paper, the compound of Span-80 and Tween-80 is selected, when the HLB value of the composite surfactant system is 6, The loose density of silver powder is as low as 1.65 g / cm ~ (-3) and the specific surface area is 2.85 m2 / g. From the SEM images, we can see that the diameter of silver powder is high, the lamination property is good, and the diameter of silver powder is uniform. (3) the curing process of bisphenol A epoxy resin E-51 was studied by differential scanning calorimetry (DSC). The curing degree of epoxy resin was analyzed from the point of view of thermodynamics. The characteristic temperature of curing process of epoxy resin at different heating rates was first fitted, and the isothermal curing temperature of the curing system was obtained by extrapolation method, and the optimum curing temperature was determined to be 160 鈩，
本文编号：2314340
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