忆阻器单元电学特性计算模拟研究
[Abstract]:At present, when the COMS device faces the size limitation of integrated technology, the memory device as a new type of nano-level memory device has attracted many scholars' attention. Low power consumption, high speed, high integration, and information storage and computing functions of the resistor, for information storage and ultra-high performance computing has brought unprecedented opportunities. As a leader in the next generation of non-volatile memory, it is expected to replace the current mainstream flash memory devices. The material related physical mechanism of the resistor is very different, the mechanism of the memory is not clear, and the performance of the memory is short of effective control methods. These reasons limit the performance improvement and the practical process of the resistive device. Although a large number of experiments have been carried out to study the memory characteristics of the device, and a certain theoretical model has been given, the internal electronic transport characterization of the device is scarce at nanometer scale. So far, there is still not a clear understanding of its specific micro-process, and there are still disputes in many places. Therefore, from the point of view of theoretical calculation and simulation, it is still the focus of current research to study the basic electrical characteristics of the resistive device and to find out the resistive mechanism of the resistive device. The simulation study of electrical characteristics of memory units will lay a theoretical foundation for the study of materials and the enhancement of memory characteristics. First-principles calculation method has been widely used in the field of material research. It can study the physical properties of materials from the microscopic level and, more importantly, it is an effective method to predict the electrical properties of materials. This method can simulate and calculate the structure, defect and doping characteristics of nanoscale devices, and analyze the simulation results from the electronic level, and predict the electrical properties of nanodevices by using the calculated results. Therefore, it is an ideal choice to study the electrical characteristics of the resistive unit by first principle calculation and to analyze the mechanism of the resistor. In this paper, the resistance mechanism of the memory element material is inferred in detail, and it is suggested that the migration of the charged vacancy defect with the applied electric field is the main cause of the resistance behavior. The model of doped vacancy defect of the memory unit was established by using the calculation software Atomistix Tool Kit. Based on the physical model analysis, the vacancy defect location in the functional layer of the memory cell at different voltages is predicted, and a series of two-electrode single-component models following the boundary migration model are established. Through the calculation and analysis of the DC I-V characteristics of the device, the resistive behavior of the device is explained reasonably. The results show that the boundary migration does change the resistance of the device. It provides a theoretical reference for future experiments and fabrication, and also provides a theoretical basis for the analysis of the mechanism of the device.
【学位授予单位】:华中科技大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TM501
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