LED照明灯具的结构设计与仿真

发布时间：2019-06-18 23:53

【摘要】：发光二级管LED被公认为第四代照明器件，具有体积小、寿命长、可靠性高等优点，已被广泛应用于交通信号灯、平板显示、市政工程以及商业照明等。当前LED照明灯具存在着许多技术难点：（1）LED驱动电源寿命短，影响灯具的使用寿命；（2）多芯片集成封装的LED COB光源的效率较低，远距离照明应用的LED光源光能的利用率较低；（3）LED照明灯具散热器的散热材料使用量大，LED光源基板与散热器之间需要涂覆导热硅脂，增加传热热阻，大功率的LED灯具的传热热阻大。本论文的主要工作有： 1、设计了可更换驱动电源的LED照明灯具，当驱动电源发生故障时，使用者只需更换故障的驱动电源即可。把驱动电源设计成一个独立的可更换的模块，通过卡扣或螺纹结构与散热器实现机械连接，通过圆形电连接器或电极与LED光源基板实现导电连接，最终做出的样品灯具证明该方法可行。 2、设计了一种出光表面带有微结构的多芯片集成封装LED COB光源，利用凸起的四棱锥结构增加光源内的光出射锥角，从而提高多芯片集成封装LEDCOB光源的光效，通过光学软件仿真，光效提高50%左右；提出了一种带有环形结构的LED光源，让发散角度大的光线经反射或折射，然后以较小的发散角度出射，经光学软件仿真，结果表明发散角度较小。 3、设计了一种利用烟囱效应增强对流散热的散热装置，，把热空气约束在烟囱管道内，通过增加空气的浮升力，从而增强空气的流动；提出了一种光源散热一体化结构的散热器装置，通过导热液直接把LED光源基板的热量传导至散热器，然后通过散热器的散热翅片进行空气对流散热，对该装置进一步研究，设计出一种采用蒸汽气囊散热的散热器；仿真了对流散热不良的情况下，铝材料表面氧化和未氧化所具有的不同红外辐射发射率对照明灯具散热的影响。
[Abstract]:LED is recognized as the fourth generation lighting device, which has the advantages of small size, long life and high reliability. It has been widely used in traffic signal lights, flat panel display, municipal engineering and commercial lighting. At present, there are many technical difficulties in LED lighting lamps and lanterns: (1) the life of LED driving power supply is short, which affects the service life of lamps and lanterns; (2) the efficiency of multi-chip integrated LED COB light source is low, and the utilization rate of LED light source applied in remote lighting is low; (3) the heat dissipation material of LED lighting lamp radiator is large, the heat conduction silicone grease needs to be coated between LED light source substrate and radiator, and the heat transfer thermal resistance is increased, and the heat transfer thermal resistance of high power LED lamps and lanterns is large. The main work of this paper is as follows: 1. The LED lighting lamp with replaceable driving power supply is designed. When the driving power supply fails, the user only needs to replace the faulty driving power supply. The driving power supply is designed as an independent replaceable module, the mechanical connection is realized with the radiator through the clasp or thread structure, and the conductive connection is realized with the LED light source substrate through the circular electrical connector or electrode. Finally, the sample lamp is made to prove that the method is feasible. 2. A multi-chip integrated packaging LEDCOB light source with microstructure on the light surface is designed. The raised four-pyramid structure is used to increase the light emission cone angle in the light source, so as to improve the optical efficiency of the multi-chip integrated packaging LEDCOB light source. Through optical software simulation, the optical efficiency is increased by about 50%. A LED light source with annular structure is proposed, which makes the light with large divergence angle be reflected or refracted, and then emits at a smaller divergence angle. the results of optical software simulation show that the divergence angle is small. 3. A heat dissipation device using chimney effect to enhance convective heat dissipation is designed. The hot air is confined to the chimney pipe, and the air flow is enhanced by increasing the floating force of the air. In this paper, a radiator device with integrated structure of light source heat dissipation is proposed, in which the heat of LED light source substrate is transferred directly to the radiator through hydrothermal solution, and then the air convective heat dissipation is carried out through the radiator heat dissipation fine. the device is further studied and a radiator with steam airbag heat dissipation is designed. The effects of different infrared radiation emissivity of aluminum surface oxidation and unoxidation on the heat dissipation of lighting lamps are simulated under the condition of poor convective heat dissipation.
【学位授予单位】：华侨大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TM923.34

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