基于扰动观测器的固化炉温度解耦控制

发布时间：2017-12-27 14:23

本文关键词：基于扰动观测器的固化炉温度解耦控制　出处：《计算机工程与应用》2016年22期 　论文类型：期刊论文

【摘要】：固化炉是微电子制造过程的重要设备,它内部的温度分布具有大时滞、强耦合、非线性的特点。针对固化炉温度模型复杂和加热板热效应耦合的问题,将最小二乘法及阶跃响应法相结合,在工作点附近对固化炉温度建立一阶惯性延时模型,基于扰动观测器(disturbance observer)对芯片固化炉设计了解耦控制系统,实现了不同加热板之间的解耦控制。仿真和实验结果表明,该解耦控制方法能够抑制加热板之间的耦合影响,超调和稳态误差都较小,在过程控制中的同类系统中有较好的推广应用价值。
[Abstract]:The curing furnace is an important equipment in the microelectronic manufacturing process. The temperature distribution inside it has the characteristics of large time delay, strong coupling and nonlinear. For curing furnace temperature and heating model of complex thermal effect coupling problem, least square method and step response method combined with the establishment of an inertial delay model of curing furnace temperature in the vicinity of the operating point, based on disturbance observer (disturbance observer) on the design of chip curing furnace decoupling control system, realizes the decoupling between different heating the control board. The simulation and experimental results show that the decoupling control method can suppress the coupling effect between the heating plates, and the overshoot and steady-state error are small. It has good application value in similar systems in process control.
【作者单位】：中南大学机电工程学院;
【基金】：国家自然科学基金(No.51175519)
【分类号】：TN405
【正文快照】： 1引言微电子后道封装是芯片制造中重要的一部分,不同的封装工艺有不同的流程,但是固化是封装过程中必不可少的一步,固化过程也称塑封过程,是指将贴好芯片的引线框架置于固化炉的基板上,再把树脂加热特定温度(一般是180℃),待其充分熔融软化,加压将树脂压到引线框架中,冷却凝结

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