面向复杂半导体生产线的多产品工件合并方法研究

发布时间：2018-01-05 08:31

本文关键词：面向复杂半导体生产线的多产品工件合并方法研究　出处：《北京化工大学》2015年硕士论文　论文类型：学位论文

【摘要】：半导体制造系统是最复杂的工业制造系统之一,随着国内外信息产业与电子技术的蓬勃发展,对半导体生产技术的升级需求迫在眉睫。在客户订单多样化,生产需求小批量的背景下,对半导体生产线工件合并方法的研究,是生产调度优化领域的一个新兴方向,以优化生产指标、提高生产线加工效率为目标,重点解决工件的排序、聚类、分派等问题,为复杂制造过程的生产优化方法提供研究新思路。本文围绕半导体制造系统工件合并问题展开以下研究：(1)针对半导体制造系统缓冲区实际生产调度过程,分析半导体工件合并理论的基础及相关约束条件,简要介绍工件在聚类过程中,从生产线上获得的不同类型数据的处理方法,以及常用的聚类算法,为后续研究提供理论基础。(2)针对半导体制造系统订单数量大、产品种类多、交货期广等特点,研究一种多产品工件合并方法。通过一组复合排序规则对缓冲区工件进行排序合并,并利用迭代法优化合并决策,然后借鉴闭环控制思想研究一种动态修正工件加权因子策略,以降低生产线不确定事件的发生带来的影响。(3)以最小化平均加工周期与订单拖期率为目标,通过提取半导体生产线工件特征属性,设计一种相融于工件特征属性权值优化的模糊C均值聚类算法,以聚类结果指导工件合并过程推进,以此改善半导体生产线加工性能。
[Abstract]:Semiconductor manufacturing system is one of the most complex industrial manufacturing systems. With the rapid development of information industry and electronic technology at home and abroad, it is urgent to upgrade the semiconductor manufacturing technology. Under the background of small batch production demand, the research on the workpiece merging method of semiconductor production line is a new direction in the field of production scheduling optimization. The goal is to optimize the production index and improve the processing efficiency of the production line. Focus on solving the problem of job sorting, clustering, assignment and so on. This paper focuses on the following research on the integration of semiconductor manufacturing system parts: 1) the actual production scheduling process for the buffer zone of semiconductor manufacturing system. This paper analyzes the basis of semiconductor workpiece merging theory and related constraints, briefly introduces the processing methods of different types of data obtained from the production line in the process of job clustering, as well as the usual clustering algorithms. To provide a theoretical basis for the follow-up study. (2) aiming at the semiconductor manufacturing system order quantity large, product types, wide delivery time and other characteristics. In this paper, a method of multi-product job merging is studied. A set of composite collation rules is used to sort and merge buffer jobs, and iterative method is used to optimize the merging decision. Then a dynamic modified workpiece weighting factor strategy based on closed-loop control is proposed to reduce the impact of uncertain events in production line. The goal is to minimize the average processing cycle and order delay rate. By extracting the feature attributes of the workpiece in the semiconductor production line, a fuzzy C-means clustering algorithm is designed, which is integrated with the weight optimization of the workpiece characteristic attribute, and the clustering results can guide the process of workpiece merging. In order to improve the processing performance of semiconductor production line.
【学位授予单位】：北京化工大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN305

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