电路模块堆叠立体组装技术研究

发布时间：2018-01-05 14:26

本文关键词：电路模块堆叠立体组装技术研究　出处：《西安电子科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着电子产品特别是高精尖设备的尺寸和重量日趋变小,实现复杂电路功能的集成电路板变的越来越小、越来越轻,需要堆叠在一起的板的层数也越来越多,器件的精密度要求相应的变高。原有的组装技术已经不能满足电子组装技术的要求,需要探索一种既能减轻设备质量、缩小设备体积,延长系统续航时间,又能提高设备便携能力的组装工艺方法,即堆叠立体组装技术。本文针对目前电路模块设备重量和体积较大,不能满足设备小型化、高可靠性要求的需求瓶颈,研究器件立体堆叠组装工艺技术,通过使用板级电路模块堆叠立体组装技术,提高电子设备制造工艺技术水平,实现电子测控设备的小型化、轻量化、模块化,满足测控设备的变批量研制生产的需要。文章概述了堆叠立体组装技术的研究背景、发展现状和趋势,分析研究了堆叠立体组装技术在市场应用方面的重要意义;分析了堆叠立体器件封装中电路设计方面存在的问题,并对常见的串扰、反射、电磁干扰、同步开关噪声等现象进行了具体分析,提出了解决方法;对堆叠模块内电源、接地、信号与层之间的相互连接等问题进行了研究,采用目前最为先进的垂直互连技术,确保堆叠立体组装器件电气性能较好的实现,通过控制再流焊过程的温度,减小器件滑移、翘曲和桥连发生的概率;分析了堆叠组装器件贴片环节存在的精度问题,针对问题提出了相应的解决方法,对堆叠立体组装过程中出现的翘曲问题进行了分析。本文所研究的组装技术还可广泛用于电气可靠性要求高、整机体积和重量严格受限的电子设备的制造中,满足未来高精尖设备电路模块的研制要求,使电子设备在包含更多功能、保持电气连接可靠性的同时,实现小型化和轻量化。该技术研究成果可推广到其它电子模块的批量组装中。
[Abstract]:Along with the electronic products especially the size and weight of sophisticated equipment is smaller, the integrated circuit board to achieve complex circuit functions become more and more small, more and more light, need to be stacked together with the number of layers is also more and more, the corresponding precision requirements of the device becomes high. The original assembly technology has been unable to meet the electronic assembly the technical requirements, we need to explore a kind of equipment which can reduce the quality, reduce the volume of the device and prolong the system life time, assembly process and improve the ability of portable devices, the stacked assembly technology. In this paper the circuit module device weight and large volume, can not meet the demand of equipment miniaturization, high reliability requirements of the bottleneck study on three-dimensional stacked assembly technology, component technology, through the use of a board level circuit stacked assembly technology, improve the technical level of manufacturing process of electronic equipment, electronic measurement Control equipment miniaturization, lightweight, modular, meet the control equipment and batch production needs development. This paper summarizes the research background of stacked assembly technology, the development status and trend analysis, the significance of stacked assembly technology in the market applications; analysis of existing circuit stacked packages in the design, and the common reflection, crosstalk, electromagnetic interference, analyzes the phenomenon of synchronous switch noise, puts forward the solving method of power supply module; stacking, grounding, mutual connection between the signal and the layer was studied, using the most advanced technology to ensure vertical interconnection. The electrical performance of stacked assembly devices better, by controlling the reflow process of the temperature reducing device, sliding, warping and bridging the probability of occurrence; analysis of the stacked ring patch assembly device The problems existing in the precision problem, puts forward corresponding solving methods, the problems of warpage of stacked assembly process were analyzed. The assembly technology can also be widely used in electrical reliability of electronic equipment manufacturing, the volume and weight of strict limitation in the future development of high-tech equipment to meet the requirements circuit module, electronic equipment contains more features, while maintaining electrical connection reliability, miniaturization and lightweight. The research results can be extended to other bulk electronic module assembly.

【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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