微波毫米波宽带功分放大模块研究
发布时间:2018-01-06 01:05
本文关键词:微波毫米波宽带功分放大模块研究 出处:《电子科技大学》2015年硕士论文 论文类型:学位论文
【摘要】:无论是军事领域还是民用产品,作为无线通信和电子侦察系统关键组成部分之一的宽带放大器越来越受到各国重视,整个无线通信系统的性能好坏直接取决于它。本文研究了一个具有四个功分放大通道的微波毫米波宽带功分放大模块,包括L波段(1.2GHz)通道,S、C、X波段(2-18GHz)通道,K波段(20.2GHz)通道以及K、Ka波段(22-40GHz)通道。具体工作内容如下:1.对微波毫米波宽带放大技术的研究背景和研究意义作了简要介绍,并列举了在微波毫米波宽带放大领域国内外的发展动态。2.简要介绍了放大器的基本理论知识,包括:放大器的种类和用途、放大器的基本结构以及微波毫米波放大器的主要技术指标等,为接下来对微波毫米波宽带功分放大模块的设计提供理论支持。3.首先详细分析了微波毫米波宽带功分放大模块的各项技术指标,然后依据技术指标要求,分别对四个通道:2-18GHz宽带功分放大通道、1.2GHz点频功分放大通道、22-40GHz宽带功分放大通道以及20.2GHz点频功分放大通道提出了初步设计方案,并对设计原理进行了详细分析。4.利用Ansoft HFSS仿真软件对设计方案中所使用的无源器件-功分器进行仿真,包括:22-40GHz通道功分器,20.2GHz和2-18GHz通道功分器。5.结合初步设计方案进行单片器件选型,并对所选用的部分单片器件(如HMC463、CHA2097a等)分别设计加工出验证模块进行单独验证,并依据测试结果完成最终方案设计。然后结合最终设计方案完成其它拓扑电路的设计工作,包括2-18GHz通道和1.2GHz通道功分放大链路的偏置电路与检波电路设计、22-40GHz通道和20.2GHz通道功分放大链路的偏置电路与检波电路设计以及整个微波毫米波宽带功分放大模块的比较电路设计等。6.对两个单元模块分别进行测试,并对测试结果进行分析。测试工作完成之后,将2-18GHz通道和1.2GHz通道功分放大链路单元模块、22-40GHz通道和20.2GHz通道功分放大链路单元模块以及整个微波毫米波宽带功分放大模块的比较电路进行装配,最后完成整个系统的归一化供电工作。7.对本文的主要工作进行了总结,指出了不足之处,并提出了下一步工作展望。
[Abstract]:Whether military or civilian products, as the key system of wireless communication and electronic reconnaissance. Part of the broadband amplifier more and more national attention, the performance of the whole wireless communication system depends directly on it. This paper has a four power on channel microwave and millimeter wave broadband power amplifier module, including L band (1.2GHz) channel, S, C, X band (2-18GHz) channel, K channel and K band (20.2GHz), Ka band (22-40GHz) channel. The specific works are as follows: 1. on the microwave amplification technology of millimeter wave broadband background and significance of the research are briefly introduced, and lists in the microwave and millimeter wave broadband amplification.2. developments in the field at home and abroad are briefly introduced. The basic theoretical knowledge, including the types and uses of amplifier amplifier, amplifier basic structure and main technology of microwave and millimeter wave amplifier The index, the technical indicators to provide theoretical support for the design of.3. next to the microwave and millimeter wave broadband power amplifier module of the first detailed analysis of the microwave and millimeter wave broadband power amplifier module, then according to the technical requirements, each of the four channels: 2-18GHz broadband power amplifier channel, 1.2GHz frequency power amplifier channel. 22-40GHz broadband power divider preliminary design amplifier amplification channel and 20.2GHz channel frequency power, and the design principle of a detailed analysis of.4. using Ansoft HFSS simulation software used to design the source device - power splitter is simulated, including: 22-40GHz channel power divider, 20.2GHz and 2-18GHz channel. Is.5. with the preliminary design scheme of monolithic device selection, and on the part of the monolithic device (such as HMC463, CHA2097a etc.) were designed and manufactured for the separate test verification module Based on the testing results, completed the final design. Then combined with the final design to complete the design work of other topologies, including the design of bias circuit and detection circuit of 2-18GHz channel and 1.2GHz channel power amplifying link, design of bias circuit and detection circuit of 22-40GHz channel and 20.2GHz channel power amplifying link and the microwave and millimeter wave broadband power amplifier module circuit design comparison of two.6. modules were tested, and the test results are analyzed. After the test is completed, 2-18GHz channel and 1.2GHz channel power amplifying link unit module, the comparison circuit of 22-40GHz channel and 20.2GHz channel power amplifying link unit module and the broadband microwave and millimeter wave power amplifier module assembly, finally completed the main work of the whole system of the normalized power supply of the.7. In this paper, the shortcomings are pointed out, and the future work prospect is put forward.
【学位授予单位】:电子科技大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TN722.75
【参考文献】
相关期刊论文 前1条
1 刘自明,李淑芳;国内外微波毫米波单片集成电路的现状和发展趋势[J];半导体技术;1992年03期
,本文编号:1385611
本文链接:https://www.wllwen.com/kejilunwen/dianzigongchenglunwen/1385611.html