微波模块再流焊热—力分析及再流焊控制界面优化

发布时间：2018-01-09 21:51

本文关键词：微波模块再流焊热—力分析及再流焊控制界面优化　出处：《东南大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着表面贴装技术的迅速发展,高度集成化和窄间距化的微电子封装对焊接工艺提出了更高的要求,通过实验研究的传统方法已经越来越跟不上电子行业的快速发展节奏了。模拟仿真却可以解决这个问题,通过建立有限元仿真模型可以快速准确地求解焊件的温度场,确定再流焊组件的温度曲线,进一步也可以得到焊件的应力场和翘曲变形,从而对优化结构提供支持。因此,有限元热分析和结构分析越来越多地用于分析焊件温度曲线、优化再流焊工艺参数、计算焊件应力和变形以及优化焊件结构。本文研究的是某LTCC (Low-temperature Cofired Ceramic,低温共烧陶瓷)微波组件的再流焊过程,为保证和提高焊接质量完成了以下工作。1.分析了LTCC微波组件的再流焊加热机理,对组件在再流焊中的加热环境进行了理论计算,并将其转化为有限元模型的边界条件和初始条件。2.建立了微波组件的热力学仿真模型,得到组件的温度场以及温度曲线,通过分析温度场以及温度曲线,总结了影响温度场的两个因素：先后关系和组件结构。并以此为基础详细阐述了组件在再流焊中温度场的变化趋势,发现焊件在刚出冷却区时的温度分布最不均匀。为工艺优化提供了支持。3.通过合理的传热学简化,理论计算了组件的温度曲线。并利用热电偶,测量了组件典型位置(高温区域、低温区域及LTCC)的温度曲线。仿真结果与理论计算、实测曲线完全吻合,三种方法得到的曲线都一致显示出了温度曲线的特点：先后关系和分段现象。仿真与实测结果的温度偏差在8.7%以内。4.对热变形的产生机理进行了分析,建立了计算组件的应力和结构变形的有限元模型。通过模型的计算结果,提出了优化LTCC的圆角尺寸、使用合适尺寸热匹配材料和施加外力约束变形等缓解LTCC应力集中的方案,提出优化壳体侧壁尺寸和增加厚度作为减小组件的翘曲变形的方案。并对提高再流焊质量提出了优化建议。5.优化了再流焊监控界面,提高了其用户体验和友好性。为保证再流焊质量,用户需要监控再流焊参数,而原始的再流焊控制界面存在加重用户认知负担的不足,针对其不足提出了界面的改进方案,并利用眼动实验证明了用户使用优化后界面时,搜索和获取信息速度得到了大大的提高。
[Abstract]:With the rapid development of surface mount technology, microelectronic packaging is highly integrated and narrow spacing has put forward higher requirements on the welding process. Through the traditional experimental method has been more and more to keep up with the pace of the rapid development of the electronics industry. The simulation can solve this problem by establishing a finite element simulation model fast and accurate solving the welding temperature field, determine the temperature curve of reflow soldering components, further can also get the welding stress and warpage deformation, so as to provide support for the optimization of structure. Therefore, the structure analysis and finite element analysis is more and more used in thermal analysis of welding temperature curve, optimization of reflow soldering the process parameters, the calculation of welding stress and deformation and the optimization of welding structure. This paper is a LTCC (Low-temperature Cofired Ceramic, LTCC) reflow process for microwave components. To ensure and improve the quality of welding work of.1. reflow heating mechanism of LTCC microwave components, the components are calculated in the reflow heating environment in welding, and transformed into finite element model boundary conditions and initial conditions of.2. established the thermodynamic simulation model of microwave components, temperature field and the temperature curve of components, through the analysis of the temperature field and temperature curve, summed up the two factors that influence the temperature field: has relationship and assembly structure. And on the basis of detailed components in the changing trend of reflow welding temperature field, welding temperature was found when the uneven distribution of cooling provide support for the.3.. Through the reasonable simplification for heat transfer process optimization, theoretical calculation of temperature curve components. And using typical position measuring component thermocouple, (low temperature and high temperature area LTCC area) The temperature curve. Simulation results and theoretical calculations, the measured curves coincide, the three methods are consistent curves have shown the characteristics of temperature curve: sequence and piecewise phenomenon. The temperature deviation of the simulated and measured results within 8.7%.4. of the thermal deformation mechanism for the analysis, established the finite element the deformation force and the structure of the model components. Through the model calculation results, proposed the optimized LTCC fillet sizes, using a suitable size thermal matching material and force constraint deformation to alleviate LTCC stress concentration, optimize the size and thickness of the side wall of the casing as reduce component warpage and the scheme. To improve the quality of reflow puts forward suggestions to optimize.5. optimized reflow monitoring interface, improve the user experience and friendliness. In order to ensure the quality of reflow, users need to monitor the reflow. Number, and the original reflow control interface has the disadvantages of aggravating the user's cognitive burden. Aiming at its shortcomings, the interface improvement plan is put forward. The eye movement experiment proves that the speed of searching and obtaining information has been greatly improved when users use the optimized interface.

【学位授予单位】：东南大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405

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