多层PCB过孔转换结构的信号完整性分析

发布时间：2018-01-11 13:29

本文关键词：多层PCB过孔转换结构的信号完整性分析　出处：《集美大学》2015年硕士论文　论文类型：学位论文

【摘要】：在多层印制电路板(PCB)中,过孔转换结构被广泛地用于不同层之间的信号连接。当传输高频信号时,过孔的存在会导致电源/地平面结构信号返回路径阻抗不连续,从而引起信号完整性问题,影响信号传输质量,进而妨碍高速PCB的设计。本文主要采用常单元边界元法和腔模谐振法对多层PCB电源/地平面结构进行建模分析与计算。首先,对存在单个和多个信号过孔的电源/地平面结构进行分析计算,计算出电源/地平面返回路径的输入阻抗,并提取出过孔的等效集总电路模型,同时结合PSpice软件仿真过孔的S参数,再在信号过孔周围添加短路过孔的方法来改善过孔对信号传输及串扰的影响。然后,阐述了两种求解多层PCB过孔转换结构的级联方法,包括过孔等效电路模型的级联方法和二端口网络[ABCD]矩阵级联S参数方法,仿真分析了多层PCB多个平面之间过孔级联的S参数。最后,采用三维全波电磁场分析软件HFSS仿真分析了不同差分过孔结构参数对信号传输的影响。由三维电磁场有限元软件ANSYS和HFSS验证了计算方法的准确性。研究结果表明:多层PCB电源/地平面返回路径的输入阻抗在反谐振频率处出现极大值,造成高频信号经过过孔时的传输效率很低,并使多过孔之间的耦合程度达到极大值。采用过孔等效电路模型的级联方法或者[ABCD]矩阵级联S参数的方法均可求解多层PCB过孔转换结构的级联问题。在多层PCB中使用差分过孔传输差分信号时,减小过孔半径和焊盘半径,增大反焊盘半径,并减小差分过孔的中心距,有利于提高高频信号通过差分过孔时的传输性能。论文的创新之处:(1)采用常单元边界元法并将反焊盘处入射波和反射波进行叠加,建模分析多层PCB电源/地平面输入阻抗;(2)采用场路结合的方法分析电源/地平面多过孔对信号传输以及串扰的影响;(3)采用二端口网络[ABCD]矩阵求解多层PCB过孔转换结构的级联S参数。
[Abstract]:In the multilayer printed circuit board (PCB), via transition structure is widely used in signal connection between different layers. When the high frequency signal transmission, a hole will lead to the power / ground plane structure signal return path discontinuities, causing signal integrity problems, affecting the quality of signal transmission, and design with high speed PCB. This paper mainly uses the boundary element method of constant elements and cavity resonance method of multilayer PCB power / ground plane structure modeling analysis and calculation. Firstly, the power / existence of single and multiple signal via the ground plane structure are analyzed and calculated, calculate the input impedance of the power / ground plane return path, and extracted via the equivalent lumped circuit model, combined with the parameters of S PSpice software simulation hole, adding method of short circuit vias in signal vias to improve the effect of hole around the signal transmission and crosstalk. Then, describes the two kinds of solving PCB cascade method transition pore structure, including a cascaded approach hole equivalent circuit model and two port network [ABCD] parameters S matrix method, the simulation analysis of S parameters between multilayer PCB multiple plane via cascade. Finally, the three dimensional full wave electromagnetic field analysis software HFSS simulation of the different differential vias structure parameters on the signal transmission. By the finite element software ANSYS and HFSS to verify the accuracy of the calculation method. The results show that: the input resistance of multilayer PCB power / ground plane return path resistance maximum value in the anti resonant frequency, caused by the high frequency signal through the transmission efficiency the hole is very low, and the degree of coupling between multiple vias reaches the maximum value. The method of cascade hole equivalent circuit model or [ABCD] matrix method can solve parameters of cascade S multilayer P The CB cascade structure. Using the conversion problem of hole differential via differential signal transmission in multilayer PCB, reduce the pore radius and pad radius, increase anti pad radius, and reduce hole center distance, to increase the transmission performance of high frequency signal through the differential vias. The innovations of this paper are: (1) by using constant element boundary element method and anti pad at the incident wave and reflected wave superposition analysis, multilayer PCB power / ground plane input impedance modeling; (2) analysis method by using the field circuit combined power / ground plane multiple vias on signal transmission and the effect of crosstalk; (3) using the two port network [ABCD] matrix PCB multilayer structure S cascade transition pore parameters.

【学位授予单位】：集美大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN41

【共引文献】