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面向IC封装的气浮定位平台的研究

发布时间:2018-01-19 03:03

  本文关键词: 芯片封装 定位平台 直线电机 气体润滑 气浮驱动机构 出处:《西安工业大学》2015年硕士论文 论文类型:学位论文


【摘要】:随着半导体技术的飞速发展,芯片集成度不断增大、管脚数量迅速增多、引线间距日益减小,对定位平台的精度、速度和稳定性提出了更迫切的要求。本文以高速精密定位平台为研究对象,提出了一种新型两自由度直线电机定位平台的结构,研究了其结构设计及静动态特性,并搭建了测试平台对其进行实验验证。主要研究工作及取得的成果如下:首先,综合考虑串并联机构的优缺点及直线电机驱动的优势,为了消除摩擦力对定位平台性能的影响,设计了由直线电机直接驱动的广义并联气浮定位平台,利用三维建模软件Soildworks的参数化构型方法构件零件的三维模型,通过对三维零部件结构特征的修改,使机构的空间布局合理,以满足装配、制造等方面要求。利用有限元分析软件ANSYS对所设计的平台进行静力学和动力学分析,以寻求最佳设计参数的组合,使气浮面的变形小于0.1μ m,同时,尽量减小移动部件的质量,在此基础上对定位平台的结构进行优化设计。其次,在MATLAB软件环境下,依据雷诺控制方程和气体流量守恒定律,研究了整体式气浮定位平台及气浮驱动机构的气浮特性,对气浮定位平台的承载力、气浮驱动机构在不同工况下的承载力等进行了分析研究。最后,基于上述研究内容,进行了定位平台的加工,搭建了测试平台并进行了定位平台性能的测试,实验结果与理论分析基本符合,能够满足设计要求。上述研究内容丰富了芯片封装的设计理论,对促进封装设备技术进步具有重要意义,为进一步研究高加速度气浮定位平台的制造奠定了一定的理论基础。
[Abstract]:With the rapid development of semiconductor technology, the chip integration is increasing, the number of pins is increasing rapidly, the lead distance is decreasing day by day, and the accuracy of the positioning platform. Speed and stability put forward more urgent requirements. This paper takes the high-speed precision positioning platform as the research object, proposes a new structure of a new two-degree-of-freedom linear motor positioning platform. The structure design and static and dynamic characteristics are studied, and the test platform is built to verify the structure. The main research work and the results obtained are as follows: first. Considering the advantages and disadvantages of series-parallel mechanism and the advantages of linear motor drive, in order to eliminate the influence of friction on the performance of positioning platform, a generalized parallel air-floating positioning platform driven by linear motor is designed. By using the parameterized configuration method of 3D modeling software Soildworks, the 3D model of component parts is modified to make the spatial layout of the mechanism reasonable to satisfy the assembly. The finite element analysis software ANSYS is used to analyze the statics and dynamics of the designed platform in order to find the best combination of design parameters and make the deformation of the floatation surface less than 0.1 渭 m. At the same time, the mass of moving parts is minimized, and the structure of the positioning platform is optimized. Secondly, under the environment of MATLAB, the Reynolds control equation and the law of conservation of gas flow are adopted. The characteristics of air floatation of integral air floatation platform and its driving mechanism are studied. The bearing capacity of the air floating positioning platform and the bearing capacity of the air floating driving mechanism under different working conditions are analyzed. Finally. Based on the above research content, the processing of the positioning platform is carried out, the test platform is built and the performance of the positioning platform is tested. The experimental results are basically consistent with the theoretical analysis. The above research enriches the design theory of chip packaging and is of great significance to promote the technological progress of packaging equipment. It lays a theoretical foundation for further research on the manufacture of high acceleration air floatation positioning platform.
【学位授予单位】:西安工业大学
【学位级别】:硕士
【学位授予年份】:2015
【分类号】:TN405

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