板级信号完整性、电源完整性和电磁干扰研究

发布时间：2018-01-25 22:16

本文关键词： 电磁干扰信号完整性电源完整性导体机箱屏蔽效能　出处：《内蒙古大学》2015年硕士论文　论文类型：学位论文

【摘要】：伴随着集成电子电路的工作频率和集成化程度不断的提高,PCB板布局布线越来越密集,信号之间的影响也越来越大。通过仿真手段在PCB设计阶段就对潜在的电磁干扰问题进行控制,可以降低研发成本与缩短产品开发时间。本文以理论研究为基础,利用ANSYS的SIwave、HFSS、Designer等仿真软件研究高速PCB的电磁干扰(Electromagnetic Interference, EMI)的控制方法,主要包括以下几个方面：1.在传输线理论的基础上,对高速PCB中的关键信号进行完整链路分析,主要探讨了阻抗匹配,差分走线,串扰,返回路径等信号完整性问题(Signal Integrity, SI)对电磁干扰的影响。2.探讨电源分配网络阻抗曲线与谐振的关系。以实际PCB为例,优化PI的仿真流程,探讨PI(Power Integrity, PI)对PCB远场辐射的影响。3.在研究SI/PI/EMI三者之间关系的基础上,优化传统的PCB仿真设计流程,提出更为高效,符合现代高速设计需求的设计流程。4.研究屏蔽导体的孔缝耦合效应。探讨了机箱谐振、S参数、屏蔽效能之间的关系；由于实际的机箱存在各种孔缝结构,所以本文也探讨了孔缝的大小、方向、形状以及数量等对屏蔽效能的影响,为实际机箱的优化设计提出理论指导。5.将实际PCB板的远场辐射作为辐射源导入实际机箱,探讨了实际机箱对单板的屏蔽效应,并对其优化。
[Abstract]:With the continuous improvement of the working frequency and integration degree of integrated electronic circuits, the layout and wiring of PCB board is becoming more and more dense. The influence between signals is also increasing. The potential electromagnetic interference problem is controlled by simulation in the PCB design stage. It can reduce the cost of R & D and shorten the time of product development. Based on the theoretical research, this paper makes use of ANSYS's SIwave / HFSS. Designer and other simulation software are used to study the control method of electromagnetic interference (EMI) of high-speed PCB. On the basis of transmission line theory, the key signals in high speed PCB are analyzed by complete link analysis, including impedance matching, differential routing and crosstalk. Signal integrity problem, such as return path, is a signal Integrity. The relationship between impedance curve and resonance of power distribution network is discussed. Taking the actual PCB as an example, the simulation flow of Pi is optimized. The effect of PI(Power Integrity (Pi) on the far-field radiation of PCB. 3. Based on the study of the relationship among the three SI/PI/EMI. Optimize the traditional PCB simulation design flow, propose a more efficient design process that meets the needs of modern high-speed design. 4. Study the hole slot coupling effect of shielded conductor, and discuss the box resonant S parameters. The relationship between shielding effectiveness; Because there are a variety of slot structures in the actual chassis, this paper also discusses the influence of the size, direction, shape and quantity of the slot on the shielding effectiveness. 5. The far-field radiation of the actual PCB board is introduced into the actual chassis as a radiation source, and the shielding effect of the actual chassis to the veneer is discussed and optimized.
【学位授予单位】：内蒙古大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN41

【引证文献】