高速无源电背板的串扰研究

发布时间：2018-01-28 20:31

本文关键词： 高速无源电背板串扰抑制措施协同仿真验证　出处：《国防科学技术大学》2015年硕士论文　论文类型：学位论文

【摘要】：无源电背板由PCB板和连接器构成,是高速板级互连系统中很复杂的情况。在背板互连中,串扰是众多SI问题中关键的问题之一,在芯片、封装、PCB和连接器等处都会出现串扰。随着信号传输速率的提升,串扰更加恶化,甚至引发系统失效。目前,背板互连中的串扰问题尚未引起足够重视,抑制串扰基本上也还停留在简单凭借经验的阶段。近年来,基于电磁场的电路仿真工具在功能、性能和精度等多方面都取得了较大进展。因此,基于电磁仿真软件对串扰的物理机制进行探究,提出新的串扰抑制方案,进而为高速电路的设计提供有效指导是极其迫切和必要的。本文围绕高速无源电背板中的串扰问题进行了研究,涉及串扰的理论和评估手段、互连结构的建模和仿真优化、串扰抑制措施、高速背板互连全链路的仿真与测试等。主要工作包括:(1)分析了串扰耦合机制、串扰时频域仿真流程和时频域串扰评估方法。(2)探究PCB设计中的基本要素对串扰的影响规律。(3)提出一种矩形谐振腔串扰抑制方法。通过仿真实验验证该方法对微带线间和带状线间串扰抑制的有效性,并研究矩形谐振腔的结构参数对近端串扰的影响。(4)围绕高速背板上连接器的设计进行仿真优化以减小串扰。优化连接器的引脚分配方式,包括信号/地引脚分配方式和TX/RX分配方式;对连接器的压接孔及其残桩进行分析、建模、仿真和优化,研究了通过优化结构改善串扰的方法。(5)结合前期的串扰抑制研究和工程需要,设计实现了一套25G背板实验系统。在研究背板规范IEEE802.3bj/D1.3和OIF-CEI-03.0的基础上,针对所设计的25G背板实验系统搭建背板互连的全链路仿真模型和测试平台,进行仿真和测试验证,并对通道评估参数COM和ICN用Matlab进行编程计算。基于本课题的研究,为后续25G系统的研制提供了有价值的设计指导。
[Abstract]:Passive electric backplane is composed of PCB board and connector, which is a very complex case in high-speed board-level interconnection system. Crosstalk is one of the key problems in many SI problems in chip and package. Crosstalk will appear in PCB and connector. With the increase of signal transmission rate, crosstalk will worsen and even lead to system failure. At present, the crosstalk problem in backplane interconnection has not been paid enough attention to. In recent years, electromagnetic circuit simulation tools have made great progress in many aspects, such as function, performance and precision. Based on electromagnetic simulation software, the physical mechanism of crosstalk is explored, and a new crosstalk suppression scheme is proposed. It is extremely urgent and necessary to provide effective guidance for the design of high-speed circuit. This paper focuses on the crosstalk problem in high-speed passive electric backplane, involving the theory and evaluation method of crosstalk. Modeling and simulation optimization of interconnection structure, crosstalk suppression measures, simulation and testing of high-speed backplane interconnect all links, etc. The main work includes: 1) the crosstalk coupling mechanism is analyzed. Crosstalk time and frequency domain simulation flow and time-frequency domain crosstalk evaluation method. 2) explore the basic elements in the design of PCB to the crosstalk law. A rectangular resonator crosstalk suppression method is proposed, and the effectiveness of the proposed method is verified by simulation experiments on the crosstalk suppression between microstrip lines and banded lines. The influence of the structural parameters of the rectangular resonator on the near-end crosstalk is studied. (4) the design of the connector on the high-speed backplane is simulated and optimized to reduce the crosstalk, and the pin allocation mode of the connector is optimized. Including signal / ground pin allocation mode and TX/RX allocation mode; The paper analyzes, models, simulates and optimizes the pressure-joint hole and its residual pile of connectors, and studies the method of improving crosstalk by optimizing structure. A 25G backplane experimental system is designed and implemented. Based on the research of backplane specification IEEE802.3bj/D1.3 and OIF-CEI-03.0. The full-link simulation model and test platform of backplane interconnection are built for the 25G backplane experimental system, and the simulation and test verification are carried out. The parameters of channel evaluation COM and ICN are programmed by Matlab. Based on the research of this subject, valuable design guidance is provided for the further development of 25G system.
【学位授予单位】：国防科学技术大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN41

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