两层堆叠3D-IC层间液体冷却流动及换热特性

发布时间：2018-01-31 00:52

本文关键词： 三维集成电路(D-IC) 层间液体冷却强化换热对流换热顺排微针肋　出处：《航空动力学报》2017年07期 　论文类型：期刊论文

【摘要】：随着电路层的垂直堆叠,三维集成电路(3D-IC)的功耗密度成倍增加。具有良好散热能力的层间液体冷却是一种非常有效的方法。采用数值模拟的方法研究了雷诺数在150~900范围内面积为1cm~2,针肋直径为100μm,通道高为200μm,通道间距为200μm的带有层间顺排微针肋两层芯片堆叠3D-IC内流体流动与换热特性。结果表明:与相应尺寸的矩形通道结构相比,带有层间顺排微针肋液体冷却3D-IC具有良好的换热效果。在雷诺数为770时,芯片的功率高达250W,其体积热源相当于8.3kW/cm~3;较矩形结构通道,顺排微针肋结构的热源平均温度和热源最大温差只有46.34,13.96K,分别减小了13.26,21.34K。
[Abstract]:As the circuit layer is stacked vertically. 3D integrated circuit 3D-ICs. The interlayer liquid cooling with good heat dissipation capability is a very effective method. The Reynolds number is studied by numerical simulation in the area of 1 cm ~ (2) in the range of 150 ~ 900. . The diameter of the needle rib was 100 渭 m and the channel height was 200 渭 m. The fluid flow and heat transfer characteristics in the stacked 3D-IC chip with interlaminar micropin ribs with a distance of 200 渭 m are obtained. The results show that the flow and heat transfer characteristics are compared with the rectangular channel structure of the corresponding size. When the Reynolds number is 770, the power of the chip is as high as 250 W, and the volume heat source is equal to 8.3 kW / cm ~ 3. Compared with the rectangular channel, the average heat source temperature and the maximum heat source temperature difference of the parallel row micro-needle rib structure are only 46.34 ~ 13.96 K, which are reduced by 13.26 ~ 21.34 K, respectively.
【作者单位】：北京工业大学环境与能源工程学院强化换热与过程节能教育部重点实验室;
【基金】：国家自然科学基金(51576005) 北京市自然科学基金(3142004)
【分类号】：TK124;TN40
【正文快照】： 引用格式:马丹丹,夏国栋,陈卓,等.两层堆叠3D-IC层间液体冷却流动及换热特性[J].航空动力学报,2017,32(7):1569-1576.MA Dandan,XIA Guodong,CHEN Zhuo,et al.Flow and heat transfer characteristics of interlayer liquid cooling for 3D-ICwith two stacked layers[J].Jour

【相似文献】