倒装LED封装及其散热研究

发布时间：2018-01-31 04:03

本文关键词： 发光二极管倒装填充氮化铝散热老化　出处：《南昌大学》2015年硕士论文　论文类型：学位论文

【摘要】：倒装LED与传统蓝宝石正装LED、垂直LED相比,具有无金线、高可靠性等优点,是未来LED芯片发展的趋势之一。但是同时存在着在固晶时的电极对位、芯片和基板存在热膨胀系数不匹配,容易失效等问题。本文主要研究倒装LED封装,在倒装LED芯片与支架之间的芯片PN电极间的沟道空隙填充AlN粉胶体、Al2O3粉胶体、导热胶,以减少热冲击对LED芯片,尤其是GaN发光层的影响,降低键合层热阻,增强封装芯片的散热性能。实验表明,填充剂的导热率越高、填充量量越高,封装器件的散热性能越好;但是与无填充相比,填充剂降低了灯珠2-5%的亮度,在240h老化的过程中,填充了的灯珠光功率维持率比未填充的高3-5%;其中性能最好的粉胶比为2:1的AlN粉胶体,其光功率在168h时已经比无填充的对照组的光功率高。说明填充剂在长时间的老化过程中是有效的。同时研究对比了填充剂、芯片和支架种类封装器件的光电、散热和老化性能。
[Abstract]:The inverted LED has the advantages of no gold wire, high reliability and so on, compared with the traditional sapphire formal Led and vertical LED. It is one of the development trends of LED chips in the future, but at the same time, there are electrode pairs in the solid crystal, and the thermal expansion coefficient mismatch between the chip and the substrate. In this paper, the reverse LED package is mainly studied, and the channel gap between the chip PN electrode between the inverted LED chip and the support is filled with the AlN colloid Al _ 2O _ 3 colloid and thermal conductive adhesive. In order to reduce the influence of thermal shock on LED chip, especially the GaN luminescent layer, reduce the thermal resistance of bonding layer and enhance the heat dissipation performance of the package chip, the experiment shows that the higher the thermal conductivity of the filler, the higher the filling amount. The better the heat dissipation performance of packaging devices; However, compared with the unfilled, the filler decreased the brightness of the lamp beads by 2-5%. During the aging process of 240 h, the power maintenance rate of the filled lamps was 3-5% higher than that of the unfilled ones. The best powder / gel ratio of AlN is 2: 1. The optical power of the filler at 168 h was higher than that of the control group without filling. The results showed that the filler was effective in the aging process for a long time. At the same time, the stuffing agent was studied and compared. Chip and bracket types of packaging devices for optoelectronic, heat dissipation and aging performance.
【学位授予单位】：南昌大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN312.8

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