多场耦合下基于传递熵的电路板级焊点疲劳寿命模型

发布时间：2018-02-03 00:15

本文关键词： 焊点振动与温度耦合疲劳寿命平均能量测度传递熵　出处：《中国科学:技术科学》2017年05期 　论文类型：期刊论文

【摘要】：针对实际服役条件下电路板级焊点失效引起的电子设备故障问题,基于单一时间因子传递熵方法,建立了振动与温度耦合条件下的焊点非经验疲劳寿命模型.首先,通过分析焊点裂纹萌生前后的能量变化,构建了能够表征焊点结构损伤的平均能量测度指标.其次,根据该指标在焊点微裂纹出现前呈现出的单调性特点,建立了用以评估焊点疲劳寿命的公式.最后,设计振动与温度耦合条件下的焊点加速寿命试验,基于实时获取的焊点结构动态响应信号,验证该模型的准确性与适用性.试验结果显示,该模型能够有效识别焊点的损伤状态,疲劳寿命预测结果误差在1 5%以内.
[Abstract]:In order to solve the problem of electronic equipment failure caused by PCB level solder joint failure under actual service condition, a single time factor transfer entropy method is proposed. The non-empirical fatigue life model of solder joints under the coupling of vibration and temperature is established. Firstly, the energy changes of solder joints before and after crack initiation are analyzed. The average energy measure index which can characterize the damage of solder joint structure is constructed. Secondly, according to the monotonic characteristics of the index before the appearance of micro-cracks, a formula for evaluating the fatigue life of solder joint is established. Based on the dynamic response signals of solder joint structure obtained in real time, the accuracy and applicability of the model are verified. The model can effectively identify the damage state of solder joints, and the prediction error of fatigue life is less than 1 5%.
【作者单位】：空军工程大学航空航天工程学院;
【基金】：国家自然科学基金(批准号:51201182) 陕西省自然科学基金(批准号:2015JM6345)资助项目
【分类号】：TN40
【正文快照】： 1引言电子设备服役环境越来越严酷,尤其是在航空航天与军事领域,机载或弹载电子设备通常工作在高、低温频繁转换与振动、冲击等恶劣环境中.在严酷的外部载荷条件下,电路板上的微焊点很容易出现损伤,而只要其中一个焊点发生损伤,则可能引发整个电子设备故障甚至失效.随着电子

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