复杂互连结构信号完整性建模及故障测试研究

发布时间：2018-02-27 04:33

本文关键词： 信号完整性复杂互连结构模型等效电路模型故障测试　出处：《桂林电子科技大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着集成电路设计技术的飞速发展,电子工艺技术的不断提高,各种新技术被用于电子系统的开发和设计中,与此同时,高速电路中由过孔、焊点、印制线构成的复杂互连结构的信号完整性问题日趋严重。作为一整条传输路径,过孔和焊点具有的不连续性和寄生效应,都会影响信号传输质量,在装配和生产过程中有可能出现的机械工艺故障更是会严重影响信号传播。因此,对高速电路中由过孔、焊点、印制线构成的复杂互连结构的信号完整性进行建模分析与故障测试方法的研究是十分有必要的。本文针对高速电路中的复杂互连结构的信号完整性问题主要做了如下工作:1.根据信号完整性的相关理论,重点分析了信号完整性问题中的反射和串扰问题。2.建立了由过孔、焊点、印制线构成的复杂互连结构模型,针对复杂互连结构模型的回波损耗和近端串扰进行了仿真。分析对比了不同尺寸参数下的仿真结果,得出了不连续性的强弱表现是回波损耗的主要影响因素,耦合间距和耦合长度是影响近端串扰的决定性因素的结论。3.基于传输线理论、高速电路理论等信号完整性基础理论,提出了由过孔、焊点、印制线构成的复杂互连结构的等效电路模型,并通过电路仿真验证了模型的正确性。4.针对双路径复杂互连结构进行了故障测试,提出了故障电压检测法,针对过孔裂纹故障和焊点空洞故障进行了实例验证,明确了故障电压检测法的优缺点,结果表明该测试方法可以对微小故障进行有效的测试。
[Abstract]:With the rapid development of integrated circuit design technology and the continuous improvement of electronic technology, various new technologies have been used in the development and design of electronic system. As a whole transmission path, the discontinuity and parasitic effect of passing through holes and solder joints will affect the quality of signal transmission. The possible mechanical failure in assembly and production will seriously affect the signal propagation. Therefore, for high-speed circuits by the hole, solder joint, It is necessary to model and analyze the signal integrity of complex interconnect structure with printed line and to study the method of fault testing. In this paper, the signal integrity of complex interconnection structure in high speed circuit is studied. According to the theory of signal integrity, In this paper, the reflection and crosstalk problems in signal integrity are analyzed. 2. The complex interconnection structure model is established, which is composed of holes, solder joints and printed wires. The echo loss and near-end crosstalk of the complex interconnection structure model are simulated. The simulation results under different parameters are analyzed and compared. It is concluded that the performance of the discontinuity is the main factor affecting the echo loss. Conclusion 3. Based on the basic theory of signal integrity, such as transmission line theory, high-speed circuit theory, etc. The equivalent circuit model of complex interconnect structure constructed by printed line is proved to be correct by circuit simulation. 4. The fault test of complex interconnection structure with two paths is carried out, and the fault voltage detection method is proposed. The fault of hole crack and solder joint hole is verified by examples, and the advantages and disadvantages of fault voltage detection method are clarified. The results show that the method can be used to test micro-faults effectively.
【学位授予单位】：桂林电子科技大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN405.97

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