工艺辅料引起的PCB失效案例分析

发布时间：2018-02-27 14:28

  本文关键词： 工艺辅料 残留 失效分析 失效机理　出处：《电子产品可靠性与环境试验》2016年06期 　论文类型：期刊论文

【摘要】：工艺辅料残留引起的腐蚀是PCB制程工艺中的常见问题。通过对工艺用料引起的PCB失效案例进行分析,发现工艺辅料残留主要是材料自身残留和制程操作不规范这两方面的因素引起的,掌握这些现象的机理,有利于相关工程技术人员规范操作过程、合理地选择材料,从而降低故障发生的风险。
[Abstract]:Corrosion caused by residual auxiliary materials is a common problem in PCB process. The case of PCB failure caused by process materials is analyzed. It is found that the residue of technological excipient is mainly caused by the two factors of material itself residue and non-standard process operation. Mastering the mechanism of these phenomena is beneficial to the relevant engineers and technicians in standardizing the operation process and selecting the materials reasonably. Thus reducing the risk of failure.
【作者单位】： 工业和信息化部电子第五研究所华东分所;
【分类号】：TN41.06
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本文编号：1543056