无铅玻璃粘结相对铜导电浆料性能的影响

发布时间：2018-03-16 11:31

本文选题：玻璃粉　切入点：导电浆料　出处：《功能材料》2016年02期 　论文类型：期刊论文

【摘要】：研究了无铅玻璃粘结相的熔点和含量对铜导电浆料性能的影响。采用四探针法测定铜膜的导电性,采用X射线衍射和显微组织分析对样品进行表征,并测定了铜膜的附着力。结果表明,低熔点无铅玻璃粉有利于防止铜粉高温氧化,且在较低烧结温度时,残余有机载体可以包覆铜粉,防止铜粉在低温烧结时氧化,制得的导电铜膜样品表面平整,微观组织致密,导电性好。当低熔点无铅玻璃粉含量为8%时,方阻为47.78mΩ/□,附着力为10N/cm~2左右,符合行业要求。
[Abstract]:The effect of melting point and content of lead-free glass bonding phase on the properties of copper conductive paste was studied. The conductivity of copper film was measured by four-probe method, and the samples were characterized by X-ray diffraction and microstructure analysis. The adhesion of copper film was measured. The results showed that low melting point lead-free glass powder was beneficial to prevent copper powder from oxidation at high temperature, and at lower sintering temperature, the residual organic carrier could coat copper powder and prevent copper powder from oxidizing at low temperature. When the content of lead-free glass powder at low melting point is 8, the square resistance is 47.78 m 惟 / -and the adhesion is about 10 N / cm ~ (-2), which meets the requirements of the industry.
【作者单位】：西安工程大学机电工程学院;
【基金】：陕西省科学技术研究发展计划资助项目(2013K09-33)
【分类号】：TN604

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