PCB铜表面的抗氧化处理方法

发布时间：2018-03-17 16:25

  本文选题：印制线路板　切入点：铜　出处：《南京理工大学》2015年硕士论文　论文类型：学位论文

【摘要】：随着电子技术的快速发展,PCB表面处理工艺趋向于无铅化。水性OSP(Organic Solderability Preservatives)是一种由有机唑类物质、低分子有机酸、水和助剂组成的混合溶液,它在一定的条件下与二价铜离子在铜表面形成一种致密的络合物薄膜,该薄膜不仅能在PCB的铜表面与空气间充当阻隔层,有效防止铜被氧化腐蚀,还可以在焊接前被助焊剂除去,使铜表面保持良好的可焊性。因此,OSP近些年来得到快速发展和应用。本论文基于PCB铜表面的抗氧化原理,研制出了耐高温、抗氧化时间长的OSP配方,并研究了它们用于PCB铜表面抗氧化处理的方法。具体研究内容和结果如下：首先,基于OSP与铜离子络合的基本原理和条件,探讨了OSP的主要组成,分析了影响溶液稳定性的因素,并提出一种快速测试稳定性的方法。经过试验,得到了基于苯并咪唑、苯并咪唑衍生物和苯并咪唑—苯并咪唑衍生物所组成的混合咪唑的OSP配方。这些OSP溶液稳定,室温可稳定贮存3个月以上。其次,研究了采用上述三种OSP对PCB铜表面进行抗氧化处理的方法,得到了最佳工艺条件。结果表明,在最佳工艺条件下,三种OSP都可以在PCB铜表面形成均匀、致密的抗氧化膜,可以有效延缓PCB铜表面被腐蚀1个月以上。最后,对采用三种OSP抗氧化处理的PCB铜表面的抗高温氧化性进行了研究。DSC-TG测试结构表明,它们的分解峰值都大于275℃,400℃高温时的失重都低于62%。模拟高温焊接冲击试验结果表明,在不低于300℃的高温环境下,经三种OSP抗氧化处理后的PCB铜表面,都能抗击3次以上的高温冲击而不被氧化。
[Abstract]:With the rapid development of electronic technology, the surface treatment process of OSP(Organic Solderability tends to be lead-free. Aqueous OSP(Organic Solderability reservations is a mixed solution composed of organic azoles, low molecular organic acids, water and auxiliaries. Under certain conditions, it forms a dense complex film with divalent copper ions on the surface of copper. The thin film can not only act as a barrier layer between copper surface and air of PCB, but also effectively prevent copper from being oxidized and corroded. It can also be removed by flux before welding to keep good solderability of copper surface. Therefore, OSPs have been rapidly developed and applied in recent years. Based on the oxidation resistance principle of PCB copper surface, high temperature resistance has been developed in this paper. The formula of OSP with long antioxidation time was studied, and the methods of oxidation oxidation treatment of PCB copper surface were studied. The specific contents and results were as follows: firstly, based on the basic principle and conditions of the complexation of OSP with copper ions, the main components of OSP were discussed. The factors that affect the stability of the solution are analyzed, and a method for fast testing the stability of the solution is proposed, which is based on benzimidazole. The OSP formula of mixed imidazole composed of benzimidazole derivatives and benzimidazole-benzimidazole derivatives. These OSP solutions are stable and can be stored for more than 3 months at room temperature. Three kinds of OSP were used to treat the copper surface of PCB, and the optimum conditions were obtained. The results showed that under the optimum conditions, all three kinds of OSP could form uniform and dense antioxidation film on the surface of PCB copper. It can effectively delay the corrosion of PCB copper surface for more than one month. Finally, the high temperature oxidation resistance of PCB copper surface treated with three kinds of OSP oxidation treatment was studied. Their decomposition peak values were all higher than 275 鈩，

本文编号：1625550