硅衬底CMP过程中抛光雾的控制

发布时间：2018-03-18 14:27

本文选题：抛光雾　切入点：化学机械抛光(CMP)　出处：《半导体技术》2017年12期 　论文类型：期刊论文

【摘要】：抛光雾(Haze)是硅晶圆精抛过程中表面质量评定的重要参数之一。主要研究了化学机械抛光(CMP)过程中抛光液磨料质量分数、p H值、FA/O型非离子表面活性剂和混合表面活性剂对Haze值的影响。实验结果显示,磨料质量分数为0.1%是影响Haze值变化的拐点。当磨料质量分数由2%降至0.1%时Haze值下降迅速;当磨料质量分数由0.1%降至0.01%乃至0%时Haze值稍有增加。抛光液p H值约为9.5时Haze值最低,硅片表面质量最好,在此基础上提高或降低p H值都会增加Haze值。随着非离子表面活性剂体积分数的增加,Haze值快速下降。渗透剂脂肪醇聚氧乙烯醚(JFC)和FA/O型非离子表面活性剂混合使用比单独使用其中任何一种更有利于降低Haze值,且当JFC与FA/O的体积比为3∶1时,Haze值降到0.034,满足了工业生产的要求。
[Abstract]:Haze is one of the important parameters of surface quality evaluation in the process of polishing silicon wafer. This paper mainly studies the mass fraction of polishing liquid abrasive and the mixed surface activity of FA-P / O type Nonionic surfactants in the process of polishing CMP. The effect of the sex agent on the Haze value. The experimental results show that, The Haze value decreased rapidly when the abrasive mass fraction decreased from 2% to 0.1, and the Haze value increased slightly when the abrasive mass fraction decreased from 0.1% to 0.01% or even 0. The Haze value was the lowest when the polishing fluid pH value was about 9.5. The surface quality of silicon wafer is the best. The value of Haze decreases rapidly with the increase of volume fraction of Nonionic surfactants. The mixture of fatty alcohol polyoxyethylene ether and FA/O Nonionic surfactants can increase the value of Haze. It is better to lower the Haze value than to use any of them alone. When the volume ratio of JFC to FA/O is 3: 1, the value of JFC decreases to 0.034, which meets the requirement of industrial production.
【作者单位】：河北工业大学电子信息工程学院;天津市电子材料与器件重点实验室;
【基金】：国家科技重大专项资助项目(2009ZX02308) 河北省自然科学基金青年基金资助项目(F2015202267) 天津市自然科学基金资助项目(16JCYBJC16100)
【分类号】：TN305.2

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