计及裂纹损伤的IGBT模块热疲劳失效分析

发布时间：2018-03-23 23:32

本文选题：IGBT模块　切入点：焊料层裂纹　出处：《浙江大学学报(工学版)》2017年04期

【摘要】：以实际IGBT功率模块为研究对象,通过有限元分析技术(FEM),探究裂纹损伤对IGBT模块热特性及疲劳寿命评估的影响规律,通过加速老化实验对有限元仿真结果进行验证.结果表明,焊料层裂纹是造成IGBT模块热阻增加的主要原因,在裂纹未萌生和萌生初期,裂纹对模块热特性的影响较小;一旦模块损伤到某一阶段,随着裂纹的继续扩展,模块热阻将近似指数增大,继续服役将导致功率模块在短时间内失效.通过研究发现,IGBT模块的疲劳寿命不仅与功率循环条件相关,还受到焊料层疲劳现状的影响,因此计及焊料层的疲劳累积效应的物理寿命模型相对于解析寿命模型能够更准确地对IGBT模块寿命进行评估.
[Abstract]:Taking the actual IGBT power module as the research object, the influence of crack damage on thermal characteristics and fatigue life of IGBT module is studied by finite element analysis technique. The finite element simulation results are verified by accelerated aging test. The crack of solder layer is the main reason for the increase of thermal resistance of IGBT module. At the beginning of crack initiation and initiation, the crack has little effect on the thermal characteristics of the module, and once the module is damaged to a certain stage, the crack continues to expand. The thermal resistance of the module will increase approximately, and the continued service will lead to the failure of the power module in a short time. It is found that the fatigue life of the IGBT module is not only related to the power cycle conditions, but also affected by the fatigue status of the solder layer. Therefore, the physical life model taking into account the fatigue cumulative effect of solder layer can evaluate the life of IGBT module more accurately than the analytical life model.
【作者单位】：重庆大学输配电装备及系统安全与新技术国家重点实验室;
【基金】：国家自然科学基金资助项目(51477019) 中央高校基本科研业务费资助项目(106112015CDJXY150004)
【分类号】：TN322.8

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