IGBT功率模块热传导与退化研究

发布时间：2018-04-01 05:00

本文选题：IGBT模块　切入点：结温　出处：《河北工业大学》2015年硕士论文

【摘要】：功率半导体器件IGBT(绝缘栅双极晶体管)高频化、大功率化、集成化的发展,使得IGBT模块承载更高的工作温度和温度冲击,其各层材料的热物性因往复膨胀收缩而疲劳退化,表现为给定功率及环境应力的模块工作温度升高,模块对功率应力、环境应力及系统暂态过程的容适性变差,模块的运行安全余量降低。当模块的实际工作温度超过极限安全工作温度时,就会发生不可逆转的失效。因此,研究IGBT模块的传热特性及其退化规律,对于提高IGBT模块乃至电力电子设备的性能及可靠性有重要意义。拟对IGBT模块的传热特性及其退化趋势进行理论、试验及仿真研究。首先,深入分析IGBT模块的结构和工作原理,探讨功率应力作用下IGBT模块的发热机理和传热特性的退化机理;研究能反映IGBT模块传热特性退化的热敏电参数、温度参数等物理量,选择与功率及环境应力无关、仅反映模块结构及材料属性的热阻作为传热特性的退化特征参数;根据出厂参数确定热阻下限,根据极限安全结温及降额使用规范确定热阻上限,建立模糊退化模型H(R)。其次,研发开关频率可调、负载电流可控的单相IGBT模块开关控制及温度测试系统。该系统能对IGBT模块的集电极电流、集射极电压、工作频率及占空比进行动态调节;采用DS18B20温度传感器配合无线数据采集、传输模块实现壳温的远程实时监控;采用光纤测温系统实现结温的实时在线监测;采用泰克高速记忆示波器实现集射极电压和集电极电流开通关断过程的触发录波;设计完成4个电流等级、4个频率等级的正交试验,对热敏电参数和温度试验数据进行了分析。再次,以实测平均功率损耗作为热源,对IGBT模块进行三维稳态和瞬态ANSYS仿真研究。仿真得到模块的温度场分布、结温及壳温曲线;将实测壳温曲线与仿真曲线进行比对,验证了试验结果和仿真结果的一致性。最后,研究热阻网络模型及热阻测试方法,基于实测功率损耗、结温和壳温对热阻参数进行提取;根据模糊退化模型H(R)对模块疲劳状态进行定量评估。
[Abstract]:With the development of high frequency, high power and integration of IGBT (Insulated Gate Bipolar Transistor), the IGBT module is carrying higher working temperature and temperature shock, and the thermal properties of each layer of IGBT are degenerated by reciprocating expansion and contraction.The performance is that the working temperature of the module with given power and environmental stress increases, the tolerance of the module to the power stress, environmental stress and transient process of the system becomes poor, and the safety margin of the module operation is reduced.When the actual working temperature of the module exceeds the limit safe working temperature, irreversible failure will occur.Therefore, it is of great significance to study the heat transfer characteristics and degradation law of IGBT modules for improving the performance and reliability of IGBT modules and even power electronic equipment.The heat transfer characteristics and degradation trend of IGBT module are studied theoretically, experimentally and simulated.First of all, the structure and working principle of IGBT module are analyzed in depth, the heating mechanism and heat transfer degradation mechanism of IGBT module under power stress are discussed, the thermal sensitive electrical parameters, temperature parameters and other physical quantities which can reflect the degradation of heat transfer characteristics of IGBT module are studied.The thermal resistance, which is independent of power and environmental stress, only reflects the thermal resistance of the module structure and material properties as the degradation characteristic parameter of heat transfer characteristics, determines the lower limit of thermal resistance according to the factory parameters, and determines the upper limit of thermal resistance according to the limit safety junction temperature and the usage code of reducing amount.A fuzzy degenerative model was established.Secondly, the switch control and temperature measurement system of single phase IGBT module with adjustable switching frequency and controllable load current is developed.The system can dynamically adjust collector current, collector voltage, working frequency and duty cycle of IGBT module, and realize remote real-time monitoring of shell temperature by using DS18B20 temperature sensor and wireless data acquisition.The real-time on-line monitoring of junction temperature is realized by using optical fiber temperature measurement system, and the trigger recording process of collector voltage and collector current switching off is realized by using Taike high-speed memory oscilloscope.The orthogonal test of four current levels and four frequency levels was designed and the data of thermoelectric parameters and temperature tests were analyzed.Thirdly, using the measured average power loss as the heat source, the 3D steady-state and transient ANSYS simulation of the IGBT module is carried out.The temperature field distribution, junction temperature and shell temperature curves of the module are obtained by simulation, and the measured shell temperature curve is compared with the simulation curve to verify the consistency between the experimental results and the simulation results.Finally, the thermal resistance network model and the thermal resistance testing method are studied. Based on the measured power loss, the thermal resistance parameters are extracted from the junction temperature and the shell temperature, and the fatigue state of the module is quantitatively evaluated according to the fuzzy degradation model (HGR).
【学位授予单位】：河北工业大学
【学位级别】：硕士
【学位授予年份】：2015
【分类号】：TN322.8

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