基于IGBT模块热阻的状态评估研究

发布时间：2018-04-01 18:03

本文选题：热阻状态评估　切入点：模糊理论　出处：《现代电子技术》2017年10期

【摘要】：IGBT模块在退化过程中内部材料的物理属性会发生变化,进而引起模块结壳热阻的变化,因此通过研究结壳热阻的变化情况,可以对IGBT模块的退化程度进行评估。首先研究IGBT模块的结构及热扩散特性,并利用定义法计算出初始结壳热阻,指出模块在退化过程中各层封装材料、物理参数及导热面积的变化会导致结壳热阻的变化;然后,对IGBT模块进行了温度循环老化试验,并在老化过程中测量模块的结壳热阻,研究结壳热阻在老化过程中的变化情况,发现其按指数规律退化,进而建立热阻的指数退化模型;最后,提出一种IGBT模块的模糊状态评估方法,建立了基于热阻的模糊状态评估模型,采用均匀划分的方法以IGBT模块的结壳热阻作为评估参数将模块的退化状态分为7个评估等级,并对老化后的某IGBT模块进行了模糊状态评估。
[Abstract]:The physical properties of the inner materials of IGBT module will change during the degradation process, which will cause the change of the thermal resistance of the shell. Therefore, the degradation degree of the IGBT module can be evaluated by studying the change of the thermal resistance of the shell.Firstly, the structure and thermal diffusion characteristics of IGBT module are studied, and the initial shell thermal resistance is calculated by using the definition method. It is pointed out that the change of physical parameters and thermal conductivity area of each layer of packaging material in the degradation process of the module will lead to the change of the thermal resistance of the shell.The temperature cycling aging test of IGBT module was carried out, and the shell thermal resistance of the module was measured during the aging process. The change of the shell thermal resistance in the aging process was studied. It was found that the thermal resistance degenerated according to the exponential law, and then the exponential degradation model of thermal resistance was established.Finally, a fuzzy state evaluation method of IGBT module is proposed, and a fuzzy state evaluation model based on thermal resistance is established.The thermal resistance of the crust of IGBT module is used as the evaluation parameter to divide the degradation state of the module into 7 evaluation grades, and the fuzzy state of a IGBT module after aging is evaluated.
【作者单位】：河北工业大学电气工程学院;
【基金】：国家科技支撑计划(2015BAA09B01) 国家自然科学基金项目(51377044) 河北省科技计划项目(13214303D;14214503D) 河北省科技支撑计划项目(12212171)
【分类号】：TN322.8

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